Method for measuring transient temperature of ultrafast laser micromachining
An ultra-fast laser and transient temperature technology, applied in the field of spectral measurement, to achieve reliable and efficient material temperature and stable performance
Pending Publication Date: 2022-04-19
SHANGHAI INST OF OPTICS & FINE MECHANICS CHINESE ACAD OF SCI
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[0006] The purpose of the present invention is to solve the problem of measuring the transient temperature of materials after ultrafast laser micromachining, and to use the physical phenomenon that ultrafast laser induces materials to produce blackbody radiation spectrum, and propose a method of using blackbody radiation method to measure the temperature of materials after ultrafast laser processing processing device
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[0017] The present invention will be further described below in conjunction with the accompanying drawings and embodiments, but the protection scope of the present invention should not be limited thereby.
[0018] see figure 1 , figure 1 It is a schematic diagram of a method for measuring the transient temperature of ultrafast laser micromachining. As shown in the figure, the present invention is a device for measuring ultrafast laser micromachining, including: processing and acquisition high-precision synchronization system, spectrum acquisition system, and sample morphology observation system.
[0019] The ultrafast laser micromachining device includes an ultrafast laser 1, a dichroic mirror 3 for reflecting the ultrafast laser, a microscopic objective lens 4 for focusing the ultrafast laser to the material processing area, a three-dimensional mechanical movement stage 6, and a Sample 5 on stage.
[0020] The high-precision synchronous system for processing and collection...
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The invention discloses a method for measuring the transient temperature of ultrafast laser micromachining. A system comprises an ultrafast laser micromachining device, a machining and collecting high-precision synchronization system, a spectrum collecting system and a sample morphology observation system. The processing and acquisition high-precision synchronization system enables the time zero point at the beginning of material processing to be accurately calibrated, the ultrafast laser microprocessing device is used for performing laser ultrafast pulse processing on the interior of the material, and then a blackbody radiation spectrum at any moment (nanosecond magnitude) after processing is started is acquired by the spectrum acquisition system; and the temperature at the moment is calculated through drawing. In the research process, the morphology of the machined part can be observed through a morphology observation system, and therefore research work of material temperature measurement after ultrafast laser machining is completed.
Description
technical field [0001] The invention utilizes the technique of spectrum measurement, and is a method for measuring the temperature of processed materials in ultrafast laser processing. Background technique [0002] Since the quality control of laser processing workpieces has become more and more precise and fast in recent years, more and more technological innovations have emerged in laser processing temperature measurement, both in terms of methods and accuracy. These include, for example, Langmuir probe methods, laser-induced plasma emission spectroscopy, time-resolved projection methods, pump detection methods, and blackbody radiation methods. At present, the most mature methods are mainly the Langmuir probe method by vacuum electrode bias measurement and the laser-induced plasma emission spectrometry by using the Boltzmann spectral line diagram. These temperature measurement methods are of great significance to the quality monitoring of laser processing. Laser pulse po...
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IPC IPC(8): B23K26/00B23K26/70
CPCB23K26/00B23K26/702
Inventor 赵全忠杨翃勃钱静王关德
Owner SHANGHAI INST OF OPTICS & FINE MECHANICS CHINESE ACAD OF SCI