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Terahertz metasurface structure with periodic through hole microstructure and preparation method of terahertz metasurface structure

A periodic and microstructure technology, applied in the field of terahertz metamaterials, can solve problems such as laser energy loss, processing errors, and metamaterials that cannot meet the expected performance, and achieve simple processing, avoid peak blue shift, and fast processing Effect

Pending Publication Date: 2022-04-19
FUZHOU UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the size of the focal area directly determines the processing accuracy, processing within a hundred microns inevitably introduces processing errors (dimensional errors above 10 microns), making metamaterials that are sensitive to geometrical deviations unable to achieve expected performance.
In order to achieve higher precision, the method of adjusting the laser energy or controlling the number of laser pulses is usually used, but both of these methods will lead to the loss of a part of the laser energy, and require the processing personnel to have rich processing experience

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  • Terahertz metasurface structure with periodic through hole microstructure and preparation method of terahertz metasurface structure
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[0033] In order to make the features and advantages of this patent more obvious and easy to understand, the following special examples are described in detail as follows:

[0034]The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Components generally described and illustrated in the drawings herein may be designed in combination in different configurations. Accordingly, the following detailed description of selected embodiments of the invention, provided in the accompanying drawings, is not intended to limit the scope of the claimed invention, but represents only selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art wi...

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Abstract

The invention provides a terahertz metasurface structure with a periodic through hole microstructure and a preparation method of the terahertz metasurface structure, and the terahertz metasurface structure with the periodic through hole microstructure is formed by taking two rectangular holes with the same shape and size as a unit array and arranging the two rectangular holes in a periodic array. A femtosecond laser direct writing technology is adopted in the preparation method, thin film metal is directly processed, the manufacturing process is simple and rapid, the processing efficiency is high, raw materials are cheap and easy to obtain, and large-scale industrial production is facilitated. Meanwhile, a high-multiple focusing objective lens is used for reducing the ablation area, so that the machining error is reduced, the actual machining size better conforms to the design size, and the needed standard is achieved.

Description

technical field [0001] The invention belongs to the technical field of terahertz metamaterials, in particular to a terahertz metasurface structure with a periodic through-hole microstructure and a preparation method thereof. Background technique [0002] Metamaterials have a unique ability to control electromagnetic waves, and can induce surface plasmon resonance in terahertz waves in the micro-nano scale structure size, and have become the core components of various terahertz functional devices. Terahertz devices based on metamaterials are widely used in antenna radar, waveguide transmission, high-resolution imaging, high-power terahertz sources, and high-sensitivity sensing, and some unexpected research results have been achieved. At present, most of the commonly used micro-nano processing technologies for terahertz metamaterials are manufactured by photolithography. The manufacturing process requires multiple steps such as spin coating, pre-baking, mask preparation, expos...

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Application Information

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IPC IPC(8): H01Q15/00H05K3/02G02B1/00
CPCH01Q15/0086H05K3/027G02B1/002
Inventor 黄异曾秋铭钟舜聪林廷玲钟宇杰
Owner FUZHOU UNIV
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