Method for infiltrating and connecting CuW and CuCr materials through high-entropy alloy

A high-entropy alloy and infiltration technology, applied in the field of heterogeneous material preparation, can solve problems such as low interface bonding strength, and achieve the effects of low cost, simple process and good connection adaptability

Pending Publication Date: 2022-04-29
XIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for high-entropy alloy impregnation and connection of CuW and CuCr materials, which solves the problem of low interface bonding strength of CuW / CuCr composite materials in the prior art under UHV service conditions

Method used

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  • Method for infiltrating and connecting CuW and CuCr materials through high-entropy alloy
  • Method for infiltrating and connecting CuW and CuCr materials through high-entropy alloy
  • Method for infiltrating and connecting CuW and CuCr materials through high-entropy alloy

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Effect test

Embodiment 1

[0047] The method for infiltrating and connecting CuW and CuCr materials with high-entropy alloys is specifically implemented according to the following steps:

[0048] Step 1. Weigh the following raw materials according to atomic percentage: Fe 10%, Cu 35%, Cr 35%, Zr 20%, and the sum of the atomic percentages of the above elements is 100%;

[0049] Among them, the particle size of Cu, Cr, Fe, Zr is 400 mesh, and the purity is 99.9%;

[0050] Step 2, adding the raw materials weighed in step 1 and absolute ethanol into a mixer for mixing, mixing evenly to obtain a mixture, placing the mixture in a rigid mold and pressing to obtain a high-entropy alloy green body;

[0051] The ball-to-material ratio for mixing is 30:1, and the mixing time is 12 hours;

[0052] The pressing pressure is 400Mpa, the holding time is 30s, and the height of the high-entropy alloy body is 0.5mm;

[0053] Step 3, process the CuW alloy pre-bonded end flat and clean it, dry it for later use, intercept ...

Embodiment 2

[0061] The method for infiltrating and connecting CuW and CuCr materials with high-entropy alloys is specifically implemented according to the following steps:

[0062] Step 1. Weigh the following raw materials according to atomic percentage: Fe 40%, Cu 5%, Cr 30%, Zr 25%, and the sum of the atomic percentages of the above elements is 100%;

[0063] Among them, the particle size of Cu, Cr, Fe, Zr is 200 mesh, and the purity is 99.9%;

[0064] Step 2, adding the raw materials weighed in step 1 and glycerol into a mixer for mixing, mixing evenly to obtain a mixture, placing the mixture in a rigid mold and pressing to obtain a high-entropy alloy green body;

[0065] The mixing ball-to-material ratio is 20:1, and the mixing time is 8 hours;

[0066] The pressing pressure is 100Mpa, the holding time is 60s, and the height of the high-entropy alloy body is 2mm;

[0067] Step 3, process the CuW alloy pre-bonded end flat and clean it, dry it for later use, intercept the chrome-bronz...

Embodiment 3

[0075] The method for infiltrating and connecting CuW and CuCr materials with high-entropy alloys is specifically implemented according to the following steps:

[0076] Step 1. Weigh the following raw materials according to atomic percentage: Fe 30%, Cu 25%, Cr 5%, Zr 40%, and the sum of the atomic percentages of the above elements is 100%;

[0077] Among them, the particle size of Cu, Cr, Fe, Zr is 50 mesh, and the purity is 99.9%;

[0078] Step 2, adding the raw materials weighed in step 1 and stearic acid into a blender for mixing, mixing evenly to obtain a mixture, placing the mixture in a rigid mold and pressing to obtain a high-entropy alloy green body;

[0079] The ball-to-material ratio for mixing is 10:1, and the mixing time is 8 hours;

[0080] The pressing pressure is 300Mpa, the holding time is 40s, and the height of the high-entropy alloy body is 3mm;

[0081] Step 3, process the CuW alloy pre-bonded end flat and clean it, dry it for later use, intercept the chr...

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Abstract

The invention discloses a method for connecting CuW and CuCr materials through high-entropy alloy infiltration, which comprises the following steps: adding raw materials Fe, Cu, Cr and Zr into a mixer, mixing, pressing in a rigid mold to obtain a high-entropy alloy blank, sequentially stacking the CuW alloy, the high-entropy alloy blank and the CuCr alloy in a graphite crucible from top to bottom, and carrying out high-entropy alloy infiltration connection on the CuW alloy, the high-entropy alloy blank and the CuCr alloy. And solid-phase sintering and liquid-phase connection are sequentially carried out in a sintering furnace, and the CuW / CuCr composite material is obtained. According to the invention, the connection between the heterogeneous materials CuW and CuCr is realized by introducing the four-component high-entropy alloy, the bonding mode of a Cu / W phase interface is improved, the formation of a brittle intermetallic compound phase at the interface is inhibited, and the interface bonding strength is improved.

Description

technical field [0001] The invention belongs to the technical field of preparation of heterogeneous materials, and relates to a method for infiltrating and connecting CuW and CuCr materials with high-entropy alloys. Background technique [0002] The capacitor bank circuit breaker, the key equipment of the UHV power grid, requires high-frequency breaking. Frequent switching, the CuW / CuCr monolithic material is frequently subjected to the joint action of mechanical load and thermal load, which makes the interface cracks and further propagates along the Cu / W phase interface, and finally leads to the destruction of the monolithic material along the joint surface, causing the CuW end to fall off. Therefore, how to improve the bonding strength and high temperature softening resistance of the CuW / CuCr heterogeneous material interface has become a key technology to prolong the service life of the capacitor bank switch. [0003] The CuW / CuCr interface is mainly composed of a large n...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F7/06B22F3/02B22F3/10B22F3/26C22C30/02
CPCB22F7/062B22F3/02B22F3/10C22C30/02B22F3/26
Inventor 杨晓红孙骁勇张宝察梁淑华邹军涛肖鹏
Owner XIAN UNIV OF TECH
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