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GPP diode chip production process adopting honeycomb photomask and knife scraping method

A production process, honeycomb-shaped technology, applied in the field of GPP diode chip production process, can solve problems such as graphic structure obstruction, achieve the effect of reducing environmental protection pressure, reducing costs, and saving consumables

Pending Publication Date: 2022-04-29
HANGZHOU SAIJING ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] To sum up, under the current conditions, the knife-scraping process is limited to the obstacles of the graphic structure, which makes it unable to maximize the cost advantage

Method used

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  • GPP diode chip production process adopting honeycomb photomask and knife scraping method
  • GPP diode chip production process adopting honeycomb photomask and knife scraping method
  • GPP diode chip production process adopting honeycomb photomask and knife scraping method

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Effect test

Embodiment 1

[0047] In this embodiment, a kind of GPP diode chip production process using honeycomb photolithography plate and knife scraping method is provided. A hexagonal honeycomb double-groove photolithography mask suitable for negative glue is used in this production process. The stencil, this hexagonal honeycomb double-groove lithography mask, includes a first mask and a second mask, wherein the first mask is used for the first exposure, and the second mask The plate is used for exposure during the second overlay. The photolithography mask plate can be applied in the knife-scraping process of GPP glass packaging, and only one exposure machine is needed to complete the first exposure and the second overlay exposure to realize overlay.

[0048] In order to facilitate the understanding of the flow of the subsequent GPP diode chip production process of the present invention, the specific structures of the first mask and the second mask in the hexagonal honeycomb double-groove photolitho...

Embodiment 2

[0092] In this embodiment, a GPP diode chip production process using a honeycomb photolithography plate and a knife scraping method is provided. The difference between this process and Example 1 is that it is suitable for positive resist, so the hexagonal honeycomb it uses The double-groove photolithographic mask should also be matched with the positive resist.

[0093] Specifically, in this embodiment, the structures of the first mask and the second mask are basically the same as in Embodiment 1, and the only difference is that the first photolithographic mask layer 2 and the second photolithographic mask layer The light transmission types of the light-transmitting area and the light-impermeable area in 4 are just opposite to those in the embodiment, that is to say, the light-transmitting areas in the two photolithographic mask layers in the embodiment 1 are both is an opaque area, while the opaque area in the two photolithography mask layers in Embodiment 1 is a light-transm...

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Abstract

The invention discloses a GPP diode chip production process adopting a honeycomb-shaped photomask and a knife scraping method, and relates to manufacturing of semiconductor devices. Compared with a knife scraping method technology based on a traditional pattern mask, the novel hexagonal honeycomb-shaped double-groove photoetching mask composed of the first mask and the second mask is adopted and applied to the GPP glass packaging knife scraping technology, and therefore one-time exposure and two-time overlay exposure can be completed only through one exposure machine; equipment such as a double-sided exposure machine is reduced, and meanwhile, expensive back photolithography masks and consumables required by back etching are also correspondingly saved. Moreover, the etching surface of the wafer after the secondary overlay is provided with the front cutting channel, so that the chip can be directly cut at a high speed by adopting laser, complete core particles are directly obtained, the link of manual splitting does not need to be added, and the method has the advantages of extremely high production efficiency and cost.

Description

technical field [0001] The invention relates to the technical field of manufacturing semiconductor discrete devices (diodes), in particular to a GPP diode chip production process using a honeycomb photolithography plate and a knife scraping method. Background technique [0002] Because of its unidirectional conduction properties, diodes are one of the essential discrete devices whether they are used in household circuits or in special circuits and municipal circuits. Our country started research and production as early as the 1950s. In recent years, with the country's emphasis on environmental protection, the environmental protection awareness of various enterprises has gradually increased. The traditional Open Junction acid / alkali cleaning and slotting process for producing chips (later called the OJ process), because it needs to use a large amount of acid or lye and generate a large amount of sewage discharge, has gradually been replaced by another more environmentally fr...

Claims

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Application Information

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IPC IPC(8): H01L21/329H01L21/027
CPCH01L29/6609H01L21/027Y02P70/50
Inventor 虞旭俊金家斌王俊贺鸿浩朱燕飞毛建军任亮
Owner HANGZHOU SAIJING ELECTRONICS CO LTD
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