Thermoplastic polyimide resin material with low thermal expansion coefficient and preparation method thereof

A technology of polyimide resin and low thermal expansion coefficient, which is applied in the field of low thermal expansion coefficient thermoplastic polyimide material and its preparation, and can solve the problem of decreased mechanical and thermal properties of resin products, decreased high temperature stability of resin, and reduced mechanical properties of resin etc., to achieve the effects of reducing processing temperature and melt viscosity, improving thermoplastic processability, and increasing melt index
CN114456597APending Publication Date: 2022-05-10宁波惠璞新材料有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
宁波惠璞新材料有限公司
Publication Date
2022-05-10

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Abstract

The invention discloses a thermoplastic polyimide resin material with a low thermal expansion coefficient. The thermoplastic polyimide resin material is prepared from the following components in percentage by mass: 80-99% of high-temperature-resistant thermoplastic polyimide resin of which the glass transition temperature is greater than 250 DEG C and the thermal expansion coefficient is less than 40ppm / K; 0.1-15% of thermoplastic polyimide resin having a glass transition temperature of less than 220 DEG C and a logarithmic viscosity of more than 0.30 dL / g; 0.2 to 5% of an antioxidant; and 0.2-5% of a lubricant. The invention further provides a preparation method. According to the invention, by blending with the high-molecular-weight and high-melt-index thermoplastic polyimide resin with the glass transition temperature of less than 220 DEG C and the logarithmic viscosity of more than 0.30 dL / g, and matching with the antioxidant and the lubricant, the thermoplastic processability of the resin is improved, the processing temperature and melt viscosity are reduced, and the mechanical properties of the resin are improved. The melt index, the thermoplastic stability and the service life of the product are improved.
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Description

technical field

[0001] The invention relates to the technical field of thermoplastic polyimide materials, in particular to a low thermal expansion coefficient thermoplastic polyimide material and a preparation method thereof. Background technique

[0002] Polyimide is a kind of resin material with excellent comprehensive properties. It has good thermal stability, excellent mechanical properties, good dimensional stability, excellent chemical stability, high breakdown voltage, low dielectric constant, high With the advantages of flame retardancy and low expansion coefficient, it is widely used in high-tech fields such as electronic appliances, aerospace, automobiles, and chemical machinery. On the other hand, due to the rigid molecular chains of polyimide and the strong interaction between molecules, it is difficult to melt the polymer, which limits the processing and application range of polyimide. Therefore, many methods have been developed to improve the performance of pol...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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