Rapid determination method for copper foil electroplating solution

A rapid measurement and electroplating solution technology, applied in the direction of measuring devices, instruments, scientific instruments, etc., can solve the problems of one-by-one analysis, long analysis time, cumbersome operation, etc., and achieve high detection efficiency, accurate test results, and small deviation effects

Active Publication Date: 2022-05-13
云南惠铜新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are many shortcomings such as long analysis time, cumbersome operation, and the need to analyze each element one by one.

Method used

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  • Rapid determination method for copper foil electroplating solution
  • Rapid determination method for copper foil electroplating solution
  • Rapid determination method for copper foil electroplating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0057] Embodiment, a kind of rapid assay method of copper foil electroplating solution,

[0058] S1. Determine the best experimental conditions: analyze the spectrum structure of a single reagent to confirm the best test conditions, and then verify and analyze the spectrum structure of the mixed solution;

[0059] S2. Establish a standard working curve for testing: prepare the standard reagents required for the standard curve, test the X-ray intensity of the standard solution, and establish a standard curve for testing;

[0060] S3. Verification of the accuracy of the measurement: verify the error of the test result of preparing a known concentration solution, verify the error of multiple tests of the same unknown concentration plating solution on the production site, and obtain the measurement error according to the verification test result;

[0061] S4. Put the electrolyte solution to be tested into the device for measurement, and compare it with the test standard working curv...

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PUM

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Abstract

The invention provides a rapid determination method for a copper foil electroplating solution, in surface anti-oxidation treatment of copper foil production, zinc, nickel, potassium pyrophosphate and other substances are frequently used in the electroplating solution, and the stability of the content of the substances directly determines the appearance color, the impurity content and the oxidation resistance of the copper foil, so that in the production process, the content of impurities in the copper foil is greatly reduced. How to rapidly and accurately detect the content of the substance becomes a key point of quality assurance, and the method can be used for rapidly determining zinc, nickel and potassium pyrophosphate in the copper foil surface treatment electroplating liquid; compared with an artificial titration or spectrophotometric method for testing zinc-nickel potassium pyrophosphate in the electroplating solution, the method has the advantages of high detection efficiency, no detection waste liquid and the like; according to the analysis, the content of zinc, nickel and potassium pyrophosphate in the copper foil electroplating solution is determined by using the X-fluorescence spectrometry, the test result is accurate, the deviation is small, the solution detection requirement can be completely met, and the determination method of a titration method and a spectrophotometric method can be replaced.

Description

technical field [0001] The invention relates to the technical field of copper foil electroplating, in particular to a rapid determination method for copper foil electroplating solution. Background technique [0002] In the heat resistance treatment process of the copper foil surface, the method of electroplating other metals is generally used, and a layer of multi-element metals (such as zinc and nickel) is plated on the surface of the copper foil to form a multi-element alloy at high temperature to improve the heat resistance of the copper foil. . In addition, these coatings can not only block the attack of amines in the prepreg resin on the copper foil, but also help to improve the chemical affinity between the copper foil and the substrate, thereby improving the bonding force between the copper foil and the substrate; while the coke in the electroplating solution Potassium phosphate plays a complex role, which helps to improve the dispersion and coverage of the plating s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N23/223
CPCG01N23/223
Inventor 邹迪华朱红权
Owner 云南惠铜新材料科技有限公司
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