Asymmetric Gemini cationic surfactant and preparation method thereof

A surfactant and cationic technology, which is applied in the field of asymmetric Gemini cationic surfactant and its preparation, can solve problems such as difficult to find faults, and achieve the effects of easy industrial production, simple preparation process, and improved emulsification performance

Pending Publication Date: 2022-05-24
FUZHOU UNIVERSITY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Especially if the high-density PCB is not cleaned, it will inevitably lead to the adsorption of dust between the high-density lines. Once the ambient humidity is high, it is very easy to cause a short circuit between the high-density lines and cause a fault. Once the environment is dry, the short circuit fault will disappear by itself. This type of fault not easy to find

Method used

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  • Asymmetric Gemini cationic surfactant and preparation method thereof
  • Asymmetric Gemini cationic surfactant and preparation method thereof
  • Asymmetric Gemini cationic surfactant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] (1) Dissolve 10.67 g of N,N-dimethyldodecylamine (0.05 mol) in 100 mL of ethanol. To the solution was added 2.19 mL of hydrochloric acid (0.06 mol) and stirred at 25 °C for 10 min. 11.57 mL of epichlorohydrin (0.125 mol) was added dropwise to the flask and stirred at 60 °C for 2 h. The solvent and residual epichlorohydrin were removed by vacuum rotary evaporation. Then recrystallize from acetone to obtain intermediate I-12;

[0024] (2) 10.24 g of intermediate I-12 (0.03 mol) and 8.81 g of dehydroabietylamine (0.031 mol) were dissolved in 100 mL of ethanol and poured into a single-necked flask equipped with a condenser. The mixture was stirred at 90 °C for 24 h. Then the solvent was removed by vacuum rotary evaporation, and the product obtained after recrystallization, filtration and vacuum drying was the asymmetric Gemini cationic surfactant RGS-2-12.

[0025] The infrared spectrum of the asymmetric Gemini cationic surfactant RGS-2-12 under the conditions of this e...

Embodiment 2

[0028] (1) Dissolve 12.07 g of N,N-dimethyltetradecylamine (0.05 mol) in 100 mL of ethanol. To the solution was added 2.19 mL of hydrochloric acid (0.06 mol) and stirred at 25 °C for 10 min. 11.57 mL of epichlorohydrin (0.125 mol) was added dropwise to the flask and stirred at 60 °C for 2 h. The solvent and residual epichlorohydrin were removed by vacuum rotary evaporation. Recrystallization from acetone yields intermediate I-14;

[0029] (2) 11.08 g of intermediate I-14 (0.03 mol) and 8.81 g of dehydroabietylamine (0.031 mol) were dissolved in 110 mL of ethanol and poured into a single-necked flask equipped with a condenser. The mixture was stirred at 90 °C for 24 h. Then, the solvent was removed by vacuum rotary evaporation, and the product obtained after recrystallization, filtration and vacuum drying was the asymmetric Gemini cationic surfactant RGS-2-14.

[0030] The infrared spectrum of the quaternary ammonium salt rosin-based Gemini surfactant RGS-2-14 under the con...

Embodiment 3

[0033](1) Dissolve 13.48 g of N,N-dimethylhexadecylamine (0.05 mol) in 100 mL of ethanol. To the solution was added 2.19 mL of hydrochloric acid (0.06 mol) and stirred at 25 °C for 10 min. 11.57 mL of epichlorohydrin (0.125 mol) was added dropwise to the flask and stirred at 60 °C for 2 h. The solvent and residual epichlorohydrin were removed by vacuum rotary evaporation. Recrystallization from acetone yields intermediate I-16;

[0034] (2) 11.91 g of intermediate I-16 (0.03 mol) and 8.81 g of dehydroabietylamine (0.031 mol) were dissolved in 120 mL of ethanol and poured into a single-necked flask equipped with a condenser. The mixture was stirred at 90 °C for 24 h. Then the solvent was removed by vacuum rotary evaporation, and the product obtained after recrystallization, filtration and vacuum drying was the asymmetric Gemini cationic surfactant RGS-2-16.

[0035] The emulsification performance diagram of the asymmetric Gemini cationic surfactant RGS-2-16 in this example ...

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Abstract

The invention discloses an asymmetric Gemini cationic surfactant and a preparation method thereof.The asymmetric Gemini cationic surfactant is a novel surfactant with a tricyclic diterpene structure and is prepared by the steps that N, N-dimethyl long-chain fatty amine and epoxy chloropropane are subjected to a ring-opening reaction to obtain intermediates respectively, then the intermediates react with dehydroabietylamine respectively, and purification is conducted. The prepared asymmetric Gemini cationic surfactant is novel in structure and is of an asymmetric structure, hydrophobic groups on the left side and the right side are a rosin group and long-chain alkane respectively, a rigid annular structure on the left side has good emulsifying performance on aromatic compounds, and compared with common surfactants DTAC, TTAC and CTAC with the same quaternary ammonium salt alkane chain in the market, the asymmetric Gemini cationic surfactant has the advantages that the emulsifying performance is good, and the emulsifying performance is good. The STAC has low critical micelle concentration and good cleaning performance, and shows a good cleaning effect when being compounded with other solvents.

Description

technical field [0001] The invention belongs to the technical field of surfactant preparation, in particular to an asymmetric Gemini cationic surfactant and a preparation method thereof. Background technique [0002] In my country's electronics industry, the vast majority of companies are using PCBs. The fluxes used for PCB assembly welding are divided into three categories: water-soluble, rosin, and no-clean. In principle, the cleaning type should not be cleaned. However, most manufacturers in the world still need cleaning even if they use no-clean flux welding components. In particular, if the high-density PCB is not cleaned, it will inevitably lead to the adsorption of dust between the high-density lines. Once the ambient humidity is high, it is easy to cause a short circuit between the high-density lines and cause failure. Once the environment is dry, the short-circuit fault disappears on its own. This kind of fault And difficult to find. Therefore, it is very important...

Claims

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Application Information

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IPC IPC(8): C07C215/40C07C213/04C07C213/10C09K23/18C11D1/62
CPCC07C215/40C07C213/04C07C213/10C11D1/62C07C2603/26
Inventor 侯琳熙冯浩宇张一佳徐震奇林元昊张卓凡张雪娟肖龙强赵玉来蔡静宇阴翔宇
Owner FUZHOU UNIVERSITY
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