Diamond wire and preparation method thereof
A technology of diamond wire and line speed, applied in the field of diamond wire and its preparation, can solve the problems of liquid carrying, chip removal, cooling effect reduction, etc., and achieve the effects of improving liquid carrying, reducing steel wire wear, and increasing specific surface area
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0048] The application provides a method for preparing diamond wire, comprising the steps of:
[0049] Step 1: Provide steel wire substrate;
[0050] Step 2: forming a first nickel layer by electroplating on the surface of the steel wire substrate;
[0051] Step 3: forming a sandy nickel layer on the surface of the first nickel layer;
[0052] Step 4: forming a second nickel layer by electroplating on the surface of the sand nickel layer;
[0053] Step 5: forming a plurality of concave holes on the surface of the second nickel layer, thereby forming diamond wires;
[0054] Wherein, the opening diameter of the concave hole is 0.1-3 μm, and the depression depth thereof is 0.1-1 μm.
[0055] Specifically, the opening diameter of the concave hole may be 0.1 μm, 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm or 3 μm. The concave hole may have a depression depth of 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm or 1.0 μm.
[0056] Step 1 includes a pretreatment step...
Embodiment 1
[0087] The application provides a method for preparing diamond wire, comprising the steps of:
[0088] Step 1: Provide steel wire substrate;
[0089] The specific steps are as follows:
[0090] 1a: Alkali cleaning + ultrasonic: Under ultrasonic conditions, the temperature is controlled at about 60°C, and the oil on the surface of the steel wire substrate is cleaned with NaOH solution, and the cleaning time is 50 minutes. Thus completing the first cleaning.
[0091] 1b: Hot water washing + cold water washing: First use hot water at a temperature of about 60°C to clean the steel wire substrate after the first cleaning. The cleaning time is 10 minutes, and then place the cleaned steel wire substrate at a temperature of 25°C. Wash in cold water for 10 minutes to complete the second wash.
[0092] 1c: pickling: use sulfamic acid (pH value controlled at 2.5) to activate the surface of the steel wire substrate after the second cleaning, so as to complete the pickling and facilitat...
Embodiment 21
[0117] The difference between embodiment 21 and embodiment 3 is that step five, in step five of embodiment 21, uses chemical etching to form concave holes, specifically: soak the second nickel layer in a strong acid hot solution, so that The concave holes are formed on the surface of the second nickel layer. The take-up speed for forming the concave hole is 15% of the take-up speed for forming the second nickel layer. The take-up speed for forming the second nickel layer was 10 m / min. The take-up speed for forming the concave holes was 1.5 m / min. The strong acid solution is concentrated nitric acid with a volume percentage of 25-30%. The various parameters of the diamond wire are shown in Table 1.
PUM
| Property | Measurement | Unit |
|---|---|---|
| pore size | aaaaa | aaaaa |
| depth | aaaaa | aaaaa |
| particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More