Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Inorganic-organic composite adhesive capable of being cured at room temperature and resisting temperature of 400 DEG C and preparation method thereof

A composite adhesive and room temperature curing agent technology, which is applied in the direction of inorganic adhesives, adhesives, adhesive additives, etc., can solve the problems of low bonding strength and poor temperature resistance

Pending Publication Date: 2022-05-31
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to solve the problem that existing inorganic-organic composite adhesives need to be heated to be cured, and the problem of low bonding strength and poor temperature resistance exists in room-temperature curing, and provides a room-temperature-curable and temperature-resistant 400°C inorganic-organic composite adhesive and its preparation method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0023] Specific embodiment one: In this embodiment, the room temperature curing temperature-resistant 400°C inorganic-organic composite adhesive consists of 100 parts of inorganic resin base material, 100-110 parts of inorganic toughening agent, 5-20 parts of inorganic curing agent, 3- 15 parts of curing accelerators and 2-30 parts of organic components; the organic components include hybrid organic resins and room temperature curing agents, wherein the molar ratio of the reactive groups of hybrid organic resins and room temperature curing agents is 1: 1.

specific Embodiment approach 2

[0024] Embodiment 2: In this embodiment, the inorganic resin base material is a silicate resin with a modulus of 2.3-2.4. Other components and parameters are the same as those in Embodiment 1.

specific Embodiment approach 3

[0025] Embodiment 3: In this embodiment, the silicate resin is one or a mixture of potassium silicate, sodium silicate, aluminum silicate, and potassium sodium silicate. Other components and parameters are the same as those in Embodiment 1 or 2.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
shear strengthaaaaaaaaaa
shear strengthaaaaaaaaaa
shear strengthaaaaaaaaaa
Login to View More

Abstract

The invention discloses a room-temperature-curing 400 DEG C-resistant inorganic-organic composite adhesive and a preparation method thereof, and relates to the field of adhesives, in particular to a room-temperature-curing high-temperature-resistant inorganic-organic composite adhesive and a preparation method thereof. The invention aims to solve the problems that the existing inorganic-organic composite adhesive can be cured only by heating, and the bonding strength is low and the temperature resistance is poor when the adhesive is cured at room temperature. The inorganic-organic composite adhesive is prepared from the following components in parts by mass: an inorganic resin base material, an inorganic toughening agent, an inorganic curing agent, a curing accelerator and an organic component. The method comprises the following steps: putting the inorganic toughening agent, the inorganic curing agent and the curing accelerator into a ball milling instrument, carrying out ball milling dispersion, taking out mixed powder, and putting the mixed powder into a mortar; adding an inorganic resin base material into the mixed powder, and grinding and mixing in a mortar to obtain uniform and viscous paste; the preparation method comprises the following steps: adding the organic components into a mortar, and grinding into uniform paste, thereby obtaining the inorganic-organic composite adhesive. The method is used for preparing the inorganic-organic composite adhesive.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a room temperature curing high temperature resistant inorganic-organic composite adhesive and a preparation method thereof. Background technique [0002] Regarding room temperature curing high temperature resistant organic adhesives, the currently developed adhesive products include room temperature vulcanizing silicone rubber adhesives, room temperature curing epoxy structural adhesives and other heat resistant adhesives, which are mainly used for bonding metal, rubber, and other heat resistant non-metallic materials. catch. The shear strength of EA9309 two-component epoxy adhesive produced by Dexter Company can reach 33-35Mpa at room temperature, but there is basically no bonding strength above 300°C; The strength has been greatly improved. Among them, the BK-15M adhesive is cured at 24°C for 12-24 hours, and the maximum use temperature is 350°C. However, organic adhesives have disad...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J1/02C09J11/04C09J11/06C09J11/08
CPCC09J1/02C09J11/04C09J11/06C09J11/08
Inventor 荣立平王刚张大勇朱金华李欣赵颖米长虹刘晓辉刘松浩刘野
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com