Inorganic-organic composite adhesive capable of being cured at room temperature and resisting temperature of 400 DEG C and preparation method thereof

Abstract

The invention discloses a room-temperature-curing 400 DEG C-resistant inorganic-organic composite adhesive and a preparation method thereof, and relates to the field of adhesives, in particular to a room-temperature-curing high-temperature-resistant inorganic-organic composite adhesive and a preparation method thereof. The invention aims to solve the problems that the existing inorganic-organic composite adhesive can be cured only by heating, and the bonding strength is low and the temperature resistance is poor when the adhesive is cured at room temperature. The inorganic-organic composite adhesive is prepared from the following components in parts by mass: an inorganic resin base material, an inorganic toughening agent, an inorganic curing agent, a curing accelerator and an organic component. The method comprises the following steps: putting the inorganic toughening agent, the inorganic curing agent and the curing accelerator into a ball milling instrument, carrying out ball milling dispersion, taking out mixed powder, and putting the mixed powder into a mortar; adding an inorganic resin base material into the mixed powder, and grinding and mixing in a mortar to obtain uniform and viscous paste; the preparation method comprises the following steps: adding the organic components into a mortar, and grinding into uniform paste, thereby obtaining the inorganic-organic composite adhesive. The method is used for preparing the inorganic-organic composite adhesive.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a room temperature curing high temperature resistant inorganic-organic composite adhesive and a preparation method thereof. Background technique [0002] Regarding room temperature curing high temperature resistant organic adhesives, the currently developed adhesive products include room temperature vulcanizing silicone rubber adhesives, room temperature curing epoxy structural adhesives and other heat resistant adhesives, which are mainly used for bonding metal, rubber, and other heat resistant non-metallic materials. catch. The shear strength of EA9309 two-component epoxy adhesive produced by Dexter Company can reach 33-35Mpa at room temperature, but there is basically no bonding strength above 300°C; The strength has been greatly improved. Among them, the BK-15M adhesive is cured at 24°C for 12-24 hours, and the maximum use temperature is 350°C. However, organic adhesives have disad...

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Problems solved by technology

[0005] The present invention aims to solve the problem that existing inorganic-organic composite adhesives need to be heated to be cured, and the problem of low bonding strength and poor temperature resistance exists in room-temperature curing, and provides a room-temperature-curable and temperature-resistant 400°C inorganic-organic composite adhesive and its preparation method