Room-temperature self-repairing flexible organic silicon thermal interface material with self-adhesion characteristic and preparation method of room-temperature self-repairing flexible organic silicon thermal interface material

A thermal interface material, silicone technology, applied in the direction of climate sustainability, sustainable manufacturing/processing, chemical industry, etc., can solve the problems of low self-healing efficiency, no self-adhesive performance, no self-healing, etc.

Active Publication Date: 2022-06-03
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problems of poor flexibility, poor stretchability, inability to self-repair or low self-repair efficiency at room temperature, poor thermal conductivity and no self-adhesi

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Room-temperature self-repairing flexible organic silicon thermal interface material with self-adhesion characteristic and preparation method of room-temperature self-repairing flexible organic silicon thermal interface material
  • Room-temperature self-repairing flexible organic silicon thermal interface material with self-adhesion characteristic and preparation method of room-temperature self-repairing flexible organic silicon thermal interface material
  • Room-temperature self-repairing flexible organic silicon thermal interface material with self-adhesion characteristic and preparation method of room-temperature self-repairing flexible organic silicon thermal interface material

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

Specific implementation method one

[0034]A room temperature with self -adhesion characteristics self -repairing flexible organic silicon thermal interface material, which is self -restored by the room temperature to stretch the flexible silicon thermal interface material from the room temperature self -repairing the silicon polymer and the hydroxyl function, boron nitride, silicane amino group Functional silicon nano -wire thermal conductivity is obtained through in -situ aggregation and solvent assisted assembly.

[0035] Further, the self -adhesive room temperature self -repairing flexible organic silicon polymer is based on the co -agglomeration between functional flexible organic silicon molecules. The aggregation between the functional silicon molecule of the group and the functional silicon molecule of the hydroxyl group of the hydroxyl -based group. The isocyanate group is an isoporraxylisate group. There are two types of the functional silicon molecules of isocyanate: one...

specific Embodiment approach 2

[0036] Further, the quality ratio of the quality ratio of a hydroxyl function nitrogen nitrogen nitrogen nitrogen and sirrotamidamine -based functionalized silicon nano -wire heating fillers and room temperature self -repairing organic silicon polymers is 30 to 50: 100. The mass ratio of boronized and silate functionalized silicon carbonized nano -noodles is 100: 25 ~ 50. The boron -sitrosis of hydroxyl function is a sheet layer structure with a thickness of 2 to 20nm. The size is 2 to 5 μm, and the length of the silicane amino -based silicon nano -nano is 10-50 μm.

Specific implementation method 2

[0038] A preparation method of self -adhesion characteristics self -repairing flexible organic silicon thermal interface materials, including the following steps:

[0039] Step 1. The synthesis of hydroxyl function nitrogen nitrogen nitride

[0040] (1) Mix the exfoliating water and water-free ethanol at a ratio of 1: 1-4.5 to obtain a mixed solution A evenly, and add the boron nitri...

Embodiment 1

[0046] Add functional silicon molecules Ⅰ and II, III, and IV to 1.05 ~ 1.1: 1 in an Murbi of the alcohol group and the hydroxyl group of the hydroxyl group. Stir at room temperature 1.5 to 3h to form a uniform solution D, add the total mass of the total silicon polymer to the solution D with a total mass of 30 to 50 % of the heat conductive fillers. After the ultrasonic dispersion is 30 to 60min, under the condition of nitrogen or inert gas protection and magnetic mixing conditions, 40 The reaction is 3 to 6h at 60 ° C, then open the reactor mouth, and continue to stir under 40-50 ° C to volatilize the chloroform or water -free dichloromethane until the volume of the solution becomes the original 1 / 2 to 1 / 3. After the solution is cooled to 25-30 ° C, pour it into the mold of polytetrafluoroethylene, and place the vector cabinet to continue to volatilize the remaining chloroform or water -free dichloropenhane. The room temperature is self -repairing flexible organic silicon therma...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Sheet sizeaaaaaaaaaa
Lengthaaaaaaaaaa
Login to view more

Abstract

The invention provides a room-temperature self-repairing flexible organic silicon thermal interface material with a self-adhesion characteristic and a preparation method of the room-temperature self-repairing flexible organic silicon thermal interface material. The organic silicon thermal interface material is prepared from an organic silicon polymer and a heat-conducting filler in an in-situ polymerization manner. The organic silicon polymer is obtained by copolymerization of isocyanate group functionalized organic silicon molecules and hydroxyl group functionalized organic silicon molecules, the isocyanate functionalized organic silicon molecules are synthesized, and the hydroxyl functionalized boron nitride and silane amino functionalized silicon carbide nanowire heat-conducting filler is prepared. The room-temperature self-repairing stretchable flexible organic silicon thermal interface material with the self-adhesion characteristic is prepared by controlling the structure, morphology and size of the heat-conducting filler and the molecular structure and proportion of the functionalized organic silicon, and the heat conductivity coefficient of the prepared room-temperature self-repairing stretchable flexible organic silicon thermal interface material with the self-adhesion characteristic is larger than or equal to 1.8 W/(mK); the room-temperature self-repairing efficiency is not less than 90%, the tensile strain is not less than 200%, and the bonding strength is not less than 4 MPa.

Description

Technical field [0001] The invention is the field of flexible thermal interface materials, and especially involves a self -adhesive feature room temperature self -repairing flexible silicon thermal interface material and its preparation methods. Background technique [0002] The rapid development of flexible electronic technology has become more and more urgent for related materials. Functional flexible materials are the key to flexible electronic technology to achieve rapid and large -scale application. Flexible electronic devices are also developing towards high integration, human -computer interaction, and wearable devices. A large number of integrated devices are collected on flexible materials. During the operation, a large amount of scorched ear heat will be generated. The production, gathering, and not timely heat dissipation of heat will reduce the functionality, stability and service life of flexible devices. Flexible thermal interface materials are the key materials for...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C08G83/00
CPCC08G83/001Y02P20/10
Inventor 赵立伟王德志李洪峰肖万宝曲春艳刘长威冯浩宿凯杨海冬张杨杜程李晓鹏
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap