Room-temperature self-repairing flexible organic silicon thermal interface material with self-adhesion characteristic and preparation method of room-temperature self-repairing flexible organic silicon thermal interface material

Abstract

The invention provides a room-temperature self-repairing flexible organic silicon thermal interface material with a self-adhesion characteristic and a preparation method of the room-temperature self-repairing flexible organic silicon thermal interface material. The organic silicon thermal interface material is prepared from an organic silicon polymer and a heat-conducting filler in an in-situ polymerization manner. The organic silicon polymer is obtained by copolymerization of isocyanate group functionalized organic silicon molecules and hydroxyl group functionalized organic silicon molecules, the isocyanate functionalized organic silicon molecules are synthesized, and the hydroxyl functionalized boron nitride and silane amino functionalized silicon carbide nanowire heat-conducting filler is prepared. The room-temperature self-repairing stretchable flexible organic silicon thermal interface material with the self-adhesion characteristic is prepared by controlling the structure, morphology and size of the heat-conducting filler and the molecular structure and proportion of the functionalized organic silicon, and the heat conductivity coefficient of the prepared room-temperature self-repairing stretchable flexible organic silicon thermal interface material with the self-adhesion characteristic is larger than or equal to 1.8 W / (mK); the room-temperature self-repairing efficiency is not less than 90%, the tensile strain is not less than 200%, and the bonding strength is not less than 4 MPa.

Description

Technical field [0001] The invention is the field of flexible thermal interface materials, and especially involves a self -adhesive feature room temperature self -repairing flexible silicon thermal interface material and its preparation methods. Background technique [0002] The rapid development of flexible electronic technology has become more and more urgent for related materials. Functional flexible materials are the key to flexible electronic technology to achieve rapid and large -scale application. Flexible electronic devices are also developing towards high integration, human -computer interaction, and wearable devices. A large number of integrated devices are collected on flexible materials. During the operation, a large amount of scorched ear heat will be generated. The production, gathering, and not timely heat dissipation of heat will reduce the functionality, stability and service life of flexible devices. Flexible thermal interface materials are the key materials for...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problems of poor flexibility, poor stretchability, inability to self-repair or low self-repair efficiency at room temperature, poor thermal conductivity and no self-adhesive performance of silicone thermal interface materials in the prior art. Further provided is a room temperature self-healing flexible silicone thermal interface material with self-adhesive properties and a preparation method thereof

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