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Preparation method of low-chlorine 1, 6-dihydroxy naphthalene type epoxy resin

A technology of dihydroxynaphthalene and epoxy resin, which is applied in the direction of semiconductor devices, circuits, electrical components, etc., and can solve problems such as failure to meet the use requirements in the field of semiconductor packaging, corrosion of metal parts, etc.

Pending Publication Date: 2022-07-01
安徽觅拓材料科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the epoxy resin prepared by dihydroxynaphthalene and epichlorohydrin has excellent heat resistance, mechanical properties, toughness and storage stability, etc., and is widely used in various purposes, especially in the field of electronic packaging, such as patents JP1993078573B, WO2022056668A1 and JP5135951B2, etc., but when the content of impurities and hydrolyzable chlorine in the epoxy resin exceeds the standard, it will cause corrosion of metal parts, thus failing to meet the use requirements in the field of semiconductor packaging

Method used

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  • Preparation method of low-chlorine 1, 6-dihydroxy naphthalene type epoxy resin

Examples

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preparation example Construction

[0032] A first aspect of the present invention provides a preparation method of 1,6-dihydroxynaphthalene type epoxy resin, and the preparation method comprises the following steps:

[0033] 1) Mix and dissolve 1,6-dihydroxynaphthalene and epichlorohydrin under an inert gas atmosphere; then add an alkaline aqueous solution to carry out the reaction, and carry out filtration and vacuum distillation after the reaction to provide a crude product.

[0034] 2) dissolving the crude product provided in step 1) in an organic solvent, after filtration, at a certain temperature, add an alkaline aqueous solution to the filtrate to react with a cosolvent, and the reaction is washed with water and then distilled under reduced pressure to provide 1,6 - Dihydroxynaphthalene type epoxy resin; the hydrolyzable chlorine content of the 1,6-dihydroxynaphthalene type epoxy resin is less than 100 ppm.

[0035] In the preparation method of 1,6-dihydroxynaphthalene type epoxy resin provided by the pre...

Embodiment 1

[0062] To the four-necked flask equipped with a stirrer, a thermometer, a nitrogen inlet tube, a dropping funnel, and a condenser, add 2026 g of epichlorohydrin, 350 g of 1,6-dihydroxynaphthalene, and under nitrogen protection, turn on and stir until all the solids are Dissolve, stir and heat to 50°C, start to drop 437.5g of 40wt% sodium hydroxide aqueous solution, and maintain the reaction for 4 hours. After the reaction is completed, after the temperature of the system drops to room temperature, the insoluble matter is removed by filtration, and the obtained filtrate is removed by distillation under reduced pressure. Dissolved (distillation temperature 75°C, vacuum degree -0.080MPa) to obtain 564 g of crude product.

[0063] To the crude product, add 1692 g of methyl isobutyl ketone solvent to fully dissolve it, remove insoluble inorganic salts by filtration, transfer the remaining filtrate to another four-necked flask, set the reaction temperature to 90 ° C, and then add 35...

Embodiment 2

[0066] To the four-necked flask equipped with a stirrer, a thermometer, a nitrogen inlet tube, a dropping funnel, and a condenser, add 2776 g of epichlorohydrin, 400 g of 1,6-dihydroxynaphthalene, and under nitrogen protection, turn on and stir until the solids are all Dissolve, stir and heat to 50°C, start to drop 525 g of 40wt% sodium hydroxide aqueous solution, and maintain the reaction for 4 hours. After the reaction is completed, after the temperature of the system drops to room temperature, the insoluble matter is removed by filtration, and the obtained filtrate is desolubilized by distillation under reduced pressure. (temperature 75°C, vacuum degree -0.080MPa) to obtain 646.03 g of a crude product.

[0067] To the crude product, add 2584g of methyl isobutyl ketone solvent to fully dissolve it, filter to remove insoluble inorganic salts, transfer the remaining filtrate to another four-necked flask, set the reaction temperature to be 80°C, and then add 40wt 437.5g of % so...

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Abstract

The invention relates to the technical field of epoxy resin synthesis, in particular to a preparation method of low-chlorine 1, 6-dihydroxy naphthalene type epoxy resin. The preparation method comprises the following steps: 1) mixing and dissolving 1, 6-dihydroxy naphthalene and epoxy chloropropane in an inert gas atmosphere; then adding an alkaline aqueous solution for reaction, and after the reaction, carrying out filtration and reduced pressure distillation to provide a crude product; and 2) dissolving the crude product provided in the step 1) in an organic solvent, filtering, adding an alkaline aqueous solution into the filtrate to react with a cosolvent, washing with water after the reaction is completed, and carrying out reduced pressure distillation to provide the 1, 6-dihydroxy naphthalene type epoxy resin. The 1, 6-dihydroxy naphthalene type epoxy resin obtained by the method disclosed by the invention is high in purity, low in viscosity and simple to operate, the content of hydrolyzable chlorine is lower than 100ppm, and the 1, 6-dihydroxy naphthalene type epoxy resin can be applied to the field of semiconductor electronic packaging.

Description

technical field [0001] The invention relates to the technical field of epoxy resin synthesis, in particular to a preparation method of a low-chlorine 1,6-dihydroxynaphthalene type epoxy resin. Background technique [0002] The earliest materials used for electronic packaging are ceramic and metal materials. With the development of packaging technology and material industry, electronic packaging has been converted into plastic packaging. Plastic packaging materials are mainly epoxy resin and silicone. Among them, epoxy resin has relatively low cost and simple molding process, which is suitable for mass production. It also has the following characteristics: low stress, low moisture absorption; light color; epoxy equivalent weight Numerical stability; almost no ionic impurities in the resin; low hydrolyzable chlorine content; low volatile components. Epoxy resin is one of its most important uses as an electronic packaging material. With the development of contemporary electro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/06H01L23/29
CPCC08G59/063H01L23/293
Inventor 邹敏宋凤革张琪
Owner 安徽觅拓材料科技有限公司