Packaging structure, photoelectric device and preparation method thereof

Abstract

The invention discloses a packaging structure, a photoelectric device and a preparation method thereof. The packaging structure comprises at least one buffer layer and at least one blocking layer, the buffer layer and the blocking layer are alternately stacked, the buffer layer comprises metal alkoxide, and the blocking layer is used for blocking water and oxygen. The buffer layer can provide a flat surface for the deposition barrier layer, increase an effective diffusion path and delay water and oxygen permeation, and the unreacted active alkyl and the ultraviolet absorbent left in the buffer layer in the low-temperature process can avoid damage of thermal radiation, oxygen and ultraviolet light in the subsequent process to a photoelectric device. SiOx or SiONx or a composite film layer of the SiOx or the SiONx has fewer film surface defects and lower surface stress, and also has excellent water and oxygen barrier capability. The packaging structure can be prepared through a solution method, is suitable for preparation of large-size devices, improves the utilization rate of packaging materials, and reduces the production cost.

Description

technical field [0001] The invention relates to the technical field of optoelectronic devices, in particular to a packaging structure, an optoelectronic device and a preparation method thereof. Background technique [0002] Optoelectronic devices are semiconductor optoelectronic devices based on organic or inorganic materials, which have a wide range of applications in new energy, sensing, communication, display, lighting and other fields, such as solar cells, photodetectors, OLED / QLED. [0003] The functional layer materials in the structure of optoelectronic devices are very sensitive to pollutants, water, oxygen, etc. in the atmosphere, and are easily eroded by the external environment without isolation protection, which seriously affects the service life of optoelectronic devices. Therefore, optoelectronic devices have higher packaging requirements in practical applications. For example, OLED devices need to meet water vapor permeability ≦10 -6 g / m 2 / day and oxygen pe...

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Problems solved by technology

[0006] In view of the above deficiencies in the prior art, the purpose of the present invention is to provide a packaging structure, a photoelectric device and a preparation method thereof, aiming at solving the problem of poor water-oxygen isolation effect of the existing packaging structure

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