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Manufacturing method of semiconductor lead frame etching equipment

A lead frame and etching equipment technology, which is applied in the manufacturing field of semiconductor lead frame etching equipment, can solve the problem of weak bonding force between metal materials and photosensitive dry film, and achieve continuous stability, uniformity improvement, and film thickness distribution. uniform effect

Pending Publication Date: 2022-07-08
KUNSHAN YIDING IND TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The purpose of the present invention is to provide a manufacturing method for semiconductor lead frame etching equipment, to solve the technical problem of weak bonding between the metal material and the photosensitive dry film, and to achieve the purpose of improving the bonding force between the metal material and the photosensitive dry film

Method used

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  • Manufacturing method of semiconductor lead frame etching equipment
  • Manufacturing method of semiconductor lead frame etching equipment
  • Manufacturing method of semiconductor lead frame etching equipment

Examples

Experimental program
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Effect test

Embodiment 1

[0048] like figure 1 As shown, the manufacturing method of the semiconductor lead frame etching equipment includes the following steps:

[0049] S1: Clean the copper alloy material until oil stains, impurities, and metal oxides on the surface are removed, and the surface is roughened and then dried. In step S1, a chemical dipping method is used to prepare a copper alloy with suitable surface roughness. material, the surface roughness range is 0.15-0.95μm. In this embodiment, the metal material 10 is a copper alloy coiled strip with a width of 350 mm and a thickness of 0.13 mm.

[0050] Among them, such as figure 2 As shown in the figure, the cleaning and roughening treatment includes: degreasing the copper alloy coil strip at a horizontal speed of 2m / min by ultrasonic wave→electrolytic degreasing→three-stage water washing→five-stage roughening→three-stage water washing→acid activation→three passes Washing→drying→winding. The metal oxide and grease and other stains on the ...

Embodiment 2

[0081] like figure 1 As shown, the difference from the embodiment is that the metal material 10 is a copper alloy coiled strip with a width of 108 mm and a thickness of 0.125 mm. After developing, the semiconductor lead frame material Ag140 with the product structure pattern exposed on the surface of the copper alloy material is obtained, and the area that does not need electroplating is still covered with the exposed photosensitive dry film.

[0082] like figure 1 For the Ag67 silver plating treatment shown, the semiconductor lead frame material Ag140 obtained after developing treatment from S1 to S4 and S5 is subjected to "alkali activation → three washings → six silver plating → three silver recycling → four washings → baking. Dry →" to obtain a silver-plated semiconductor lead frame intermediate product 200 .

[0083] like figure 1 As shown in the post-cleaning production line, the copper alloy material 200 treated with Ag67 silver plating will continue to run horizonta...

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Abstract

The invention belongs to the technical field of semiconductor integrated circuit lead frame etching manufacturing, and particularly relates to a manufacturing method of semiconductor lead frame etching equipment and a method for producing and processing a precise semiconductor lead frame through the semiconductor lead frame etching equipment. The method specifically comprises the following steps of: cleaning a copper alloy material, roughening the surface of the copper alloy material, laminating the material and a photosensitive dry film, exposing the material subjected to film lamination through a mask plate by adopting laser equipment, developing, etching, demolding, and performing various electrolytic metal processes. According to the semiconductor lead frame etching production and manufacturing equipment, a feasible production and manufacturing technology is provided for preparing and processing a complex and precise semiconductor lead frame; the semiconductor lead frame with the surface roughness, which is obtained by the method, is high in etching precision, surface residues are greatly reduced, various electrolytic metal films are uniformly distributed in thickness, and the bonding force of an interface of the semiconductor lead frame is remarkably improved.

Description

technical field [0001] The invention belongs to the technical field of etching and manufacturing of semiconductor integrated circuit lead frames, and in particular relates to a manufacturing method of a semiconductor lead frame etching device. Background technique [0002] In the field of semiconductor lead frame manufacturing technology, using etching technology to manufacture and process metal materials into precision semiconductor electronic products required in various high-tech fields has become a very important issue. For example, the important technical core of semiconductor integrated circuits, chip manufacturing technology is an important foundation and core component of the development of advanced science and technology; semiconductor lead frames, as chip carriers of integrated circuits, are important basic raw materials in the electronic information industry; therefore, semiconductor lead frames Frame manufacturing technology is an important basic material for man...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48C25D3/12C25D3/20C25D3/22C25D3/30C25D3/46C25D3/48C25D3/50C25D3/56C25D7/00
CPCH01L21/4821H01L21/4828H01L21/4835C25D7/00C25D3/12C25D3/48C25D3/46C25D3/50C25D3/30C25D3/22C25D3/20C25D3/56
Inventor 门松明珠周爱和
Owner KUNSHAN YIDING IND TECH CO LTD
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