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Double-line discharging equipment for high-density integrated circuit lead frame

An integrated circuit and lead frame technology, which is applied in the field of lead frame feeding equipment, can solve the problems of occupying a large area, and achieve the effect of compact and stable structure, not easy to break shaft failure, and reduce labor intensity

Pending Publication Date: 2022-07-12
东莞奥美特科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If two material strips need to be processed by electroplating, two discharge devices need to be equipped, which occupies a large area

Method used

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  • Double-line discharging equipment for high-density integrated circuit lead frame
  • Double-line discharging equipment for high-density integrated circuit lead frame
  • Double-line discharging equipment for high-density integrated circuit lead frame

Examples

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Embodiment Construction

[0057] The present invention will be described in detail below with reference to specific embodiments and accompanying drawings.

[0058] The high-density integrated circuit lead frame double-wire discharging device of this embodiment, such as figure 1 As shown, it includes a basic frame body 1, an unwinding mechanism 2, a paper delivery mechanism 3 and an end point detection mechanism 5 that can detect the end point of the material tape. One in use and one in standby, after the material belt of one unwinding mechanism 2 is completely released, the material belt of the other unwinding mechanism 2 is used immediately, and there is no need to wait for a long time to change the shaft. The upper layer of the basic frame body 1 is distributed with a delivery mechanism 3 , a middle guide wheel 4 , an end detection mechanism 5 and a material belt clamping mechanism 6 . When in use, the unwinding mechanism 2 is inserted into the reel with the lead frame tape, and the unwinding mechan...

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Abstract

The invention relates to the technical field of lead frame discharging equipment, in particular to high-density integrated circuit lead frame double-line discharging equipment which comprises a basic frame body, a discharging mechanism, a paper collecting mechanism and an end point detection mechanism capable of detecting the end point of a material belt. The two sets of discharging mechanisms respectively comprise a discharging base, discharging assemblies are arranged on the two sides of the discharging base respectively, each discharging assembly comprises a supporting shaft, a transmission module, a limiting plate and a clamping piece, the supporting shafts are detachably sleeved with the clamping pieces, the limiting plates are installed on the supporting shafts, the supporting shafts are rotatably and transversely installed on the discharging bases, and the discharging bases are further provided with discharging motors. The discharging motor is connected with the supporting shaft through the transmission module. In the using process, the material belts can be released on the two sides of the discharging mechanism respectively, the corresponding paper collecting mechanism can package film rolls separated from the corresponding material belts respectively on the two sides, and the feeding requirement of one machine with two lines is met. And the end point of the material belt can be automatically identified, manual long-term monitoring is not needed, the labor intensity is reduced, and the working efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of lead frame discharging equipment, in particular to double-wire discharging equipment for high-density integrated circuit lead frames. Background technique [0002] The high-density integrated circuit lead frame is an essential component in the manufacture of integrated circuit semiconductor components. In order to meet the needs of manufacturing integrated circuit semiconductor components, the surface local area of ​​the integrated circuit lead frame needs to be electroplated with metallic silver or nickel palladium gold. Electroplating refers to a surface processing method in which the base metal to be plated is used as the cathode in a salt solution containing pre-plated metal, and the cations of the pre-plated metal in the plating solution are deposited on the surface of the base metal through electrolysis to form a coating. , During electroplating, the plated metal or other insoluble material is used...

Claims

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Application Information

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IPC IPC(8): B65H16/04B65H16/10B65H23/26B65H18/02B65H18/10H01L23/495H01L21/48
CPCB65H16/04B65H16/103B65H23/26B65H18/026B65H18/10H01L23/495H01L21/4821
Inventor 苏骞王磊
Owner 东莞奥美特科技有限公司
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