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Dynamic PCB line compensation optimization method based on CAM

A technology of line compensation and optimization method, applied in printed circuits, printed circuit manufacturing, instruments, etc., can solve problems such as insufficient spacing, company losses, poor efficiency, etc., to reduce unnecessary losses, reduce production costs, and improve yields Effect

Pending Publication Date: 2022-07-15
苏州悦谱半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] 1. For etching pre-compensation, only the graphics can be enlarged uniformly, but problems such as insufficient spacing after enlargement need to be manually modified, barely called semi-automatic, and the efficiency is not good
[0010] 2. After the negative film is put into production, the effect of etching pre-compensation is not good, because there are various variables on the production line, thermal expansion and contraction are enough to deform the negative film or copper foil, and it is difficult to control the concentration and chemical properties of the etching solution in an ideal state
The problem areas are often localized and uneven. At this time, it takes a lot of manpower and experience to modify the negatives. It is inefficient, error-prone and difficult to manage, which is a pain point in the industry.
[0011] 3. The limitation of manual compensation is too large, manual compensation is complicated in calculation and low in efficiency, and because of the large amount of data, it is often impossible to find the most reasonable compensation interval manually, which will waste time, waste boards, and cause losses to the company

Method used

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  • Dynamic PCB line compensation optimization method based on CAM
  • Dynamic PCB line compensation optimization method based on CAM
  • Dynamic PCB line compensation optimization method based on CAM

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 1

[0055] like image 3 As shown, a CAM-based dynamic PCB circuit compensation optimization method, the specific steps include:

[0056] (1) When manufacturing 100 PCBs, the yield is monitored in real time by an optical camera.

[0057] (2) When the 20th wafer is manufactured, the yield is lower than the preset yield threshold. At this time, the CAM software will mobilize the algorithm to perform local compensation correction.

[0058] (2.1) Obtain the network structure diagram of each circuit layer in the imported PCB circuit board, obtain the graphics and line width of each circuit in the network structure diagram, and obtain or preset the following parameters:

[0059] (1) Max Line Width Compensated line width limit value (ie line width compensation threshold): 20mil;

[0060] (2) Line to Line min Spacing after compensation, the minimum spacing limit value of line to line: 8mil;

[0061] (3) The minimum spacing limit of the line to the pad object after Line to Pad min Spaci...

specific Embodiment 2

[0075] A CAM-based dynamic PCB circuit compensation optimization method can be applied to different usage scenarios. Among them, the operation mode of CAM software can be divided into manual, semi-automatic and fully automatic.

[0076] scene one

[0077] When the film is made:

[0078] Step1 Call the dynamic PCB circuit compensation optimization algorithm in the CAM software to modify the circuit diagram file;

[0079] Step2 Then use the image file to wash it into a negative;

[0080] Step3 Then use the film to cover the copper foil and then illuminate the light, and transfer the pattern to the copper foil;

[0081] Step 4: Carry out physical etching manufacturing; during etching manufacturing, if it is found that the yield rate of physical manufacturing has a tendency to be poor, slow down or stop the manufacturing;

[0082] Step5 Return to the CAM software to call the dynamic PCB circuit compensation optimization algorithm again to modify the drawing file;

[0083] Ste...

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Abstract

The invention discloses a dynamic PCB circuit compensation optimization method based on a CAM, which dynamically compensates the line width according to the distance between a circuit of a PCB circuit board circuit layer and all objects, and ensures that the minimum distance between the circuit and other objects is kept and the circuit is not broken after being etched as far as possible. According to the dynamic PCB line compensation optimization method based on the CAM, through dynamic compensation, the yield of finished circuit boards is effectively improved, the production efficiency of the circuit boards is improved, unnecessary losses are reduced, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of real-time dynamic correction graphics in PCB manufacturing industry, in particular to a CAM-based dynamic PCB circuit compensation optimization method. Background technique [0002] When the circuit board is manufactured, the circuit design drawing needs to be drawn on the negative film, and then the pattern is transferred to the copper foil, and then the pattern is etched with the etching solution. The general steps are as follows: [0003] 1. Affix the photosensitive film on the copper foil of the substrate; [0004] 2. Process the imaging data into a negative film, then use the negative film to cover the photosensitive film, and then illuminate the photosensitive film with ultraviolet light to cure the photosensitive film; "Let it cure on the photosensitive film; [0005] 3. Remove the unexposed photosensitive film; use your etching solution to etch the copper foil that is not protected by the dry fi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00G06F30/392
CPCH05K3/0005G06F30/392G06F2115/12
Inventor 王荣江严启晨徐铭岐
Owner 苏州悦谱半导体有限公司