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Preparation method of aerosol spraying process conductive silver paste for electronic circuit

A technology of conductive silver paste and electronic circuit, which is applied in the direction of cable/conductor manufacturing, circuit, conductive material dispersed in non-conductive inorganic materials, etc., can solve problems such as gas atomization, and achieve the effect of high practical application value

Active Publication Date: 2022-07-29
NANCHANG CAMPUS OF JIANGXI UNIV OF SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the embodiment of the present invention is to provide a method for preparing conductive silver paste in aerosol spraying process for electronic circuits, aiming to solve the problem of aerosolization of conductive silver paste for electronic circuits in aerosol spraying process

Method used

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  • Preparation method of aerosol spraying process conductive silver paste for electronic circuit

Examples

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Embodiment 1

[0021] A preparation method of conductive silver paste by aerosol spraying process for electronic circuits, comprising the following steps:

[0022] Step 1: Mix a certain proportion of anti-settling agent, coupling agent, surfactant, diluent and solvent to make organic additives, and take quantitative light-like spherical hollow structure silver powder and flake silver powder for later use; The mass percentage of each raw material is 10% of anti-settling agent, 28% of coupling agent, 32% of surfactant, 10% of diluent and 20% of solvent; the anti-settling agent is specifically polyamide wax, and the coupling agent is specifically KH- 570 silane coupling agent, the surfactant is a mixture of soybean lecithin and bromopalm trimethylammonium, the mass ratio of soybean lecithin and bromopalm trimethylammonium in the surfactant is 9:1, and the diluent is A6360 , the solvent is specifically solvent ECS; the mass ratio of flake silver powder and light-weight spherical-like hollow stru...

Embodiment 2

[0026] A preparation method of conductive silver paste by aerosol spraying process for electronic circuits, comprising the following steps:

[0027] Step 1: Mix a certain proportion of anti-settling agent, coupling agent, surfactant, diluent and solvent to make organic additives, and take quantitative light-like spherical hollow structure silver powder and flake silver powder for later use; The mass percentage of each raw material is 13% of anti-settling agent, 30% of coupling agent, 35% of surfactant, 12% of diluent and 10% of solvent; the anti-settling agent is specifically polyamide wax, and the coupling agent is specifically KH- 570 silane coupling agent, the surfactant is a mixture of soybean lecithin and bromopalm trimethylammonium, the mass ratio of soybean lecithin and bromopalm trimethylammonium in the surfactant is 9:1, and the diluent is A6360 , the solvent is specifically solvent ECS; the mass ratio of flake silver powder and light-weight spherical-like hollow stru...

Embodiment 3

[0031] A preparation method of conductive silver paste by aerosol spraying process for electronic circuits, comprising the following steps:

[0032] Step 1: Mix a certain proportion of anti-settling agent, coupling agent, surfactant, diluent and solvent to make organic additives, and take quantitative light-like spherical hollow structure silver powder and flake silver powder for later use; The mass percentage of each raw material is 12% of anti-settling agent, 29% of coupling agent, 33% of surfactant, 11% of diluent and 15% of solvent; the anti-settling agent is specifically polyamide wax, and the coupling agent is specifically KH- 570 silane coupling agent, the surfactant is a mixture of soybean lecithin and bromopalm trimethylammonium, the mass ratio of soybean lecithin and bromopalm trimethylammonium in the surfactant is 9:1, and the diluent is A6360 , the solvent is specifically solvent ECS; the mass ratio of flake silver powder and light-weight spherical-like hollow stru...

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Abstract

The invention is suitable for the technical field of electronic circuits, and provides a preparation method of an aerosol spraying process conductive silver paste for an electronic circuit, which comprises the following steps: step 1, mixing an anti-settling agent, a coupling agent, a surfactant, a diluent and a solvent according to a certain proportion to prepare an organic additive; step 2, taking an organic additive, and ethyl cellulose and terpilenol in a certain proportion to prepare an organic carrier as a non-conductive group; and step 3, within two hours before aerosol spraying, adding flake silver powder, light spherical hollow structure silver powder and a certain amount of absolute ethyl alcohol into the non-conductive paste, and fully mixing to prepare the conductive silver paste. According to the invention, the influence of different proportions of each component of the conductive silver paste on the performance of the conductive silver paste which can be atomized by gas and sprayed by aerosol is studied according to different modes of a gas atomization process, and the conductive silver paste can be finally applied to the field of aerosol spraying processes of electronic information products such as precise electronic circuits and the like; the method has high practical application value.

Description

technical field [0001] The invention belongs to the technical field of electronic circuits, and in particular relates to a preparation method of conductive silver paste in an aerosol spraying process for electronic circuits. Background technique [0002] In the development of the microelectronics industry, higher requirements are put forward for the process conditions and environmental protection of chip assembly, and the conductive paste has been used more and more widely. The conductive silver paste with ultrafine silver powder as the main conductive component occupies an important position, such as the patent CN 104858437 A, which relies on a high disperser to prepare silver paste, and adopts full-printed electronic technology to apply to printed conductive circuits. [0003] The existing printing technologies include screen printing technology and aerosol printing technology. Compared with screen printing technology, aerosol printing technology is a non-contact printing....

Claims

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Application Information

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IPC IPC(8): H01B13/00H01B1/22H05K1/09
CPCH01B13/00H01B1/22H05K1/092
Inventor 王柯柯赵苗朱倩李晓凯范海瀚赵心语
Owner NANCHANG CAMPUS OF JIANGXI UNIV OF SCI & TECH
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