Constant temperature control micromechanical resonator
A technology of micro-mechanical resonator and constant temperature control, applied in the direction of impedance network, electrical components, etc., can solve the problems of easy deterioration of Q value and low mechanical strength
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Embodiment 1
[0040] Embodiment 1 provides a thermostatically controlled micromechanical resonator with a three-dimensional and planar structure such as figure 1 and figure 2 As shown, the micromechanical resonator structure includes four fixed anchor points 8, four heating beams 1, a heat insulation frame 2, a drive detection electrode 5, a temperature measurement electrode 6, a resonant oscillator 10, a support beam 11 and a substrate silicon wafer 9 .
[0041] Among them, the four heating beams 1, the heat insulation frame 2, and the temperature measuring electrodes 6 constitute a constant temperature control module, the resonator 10 and the support beam 11 constitute a resonance module, and the four anchor points 8, The substrate silicon wafer 9 constitutes a connection module, and the drive detection electrode 5 serves as a drive detection module.
[0042] The substrate silicon wafer 9 has a front cavity structure; the resonator 10 is located in the inner area enclosed by the heat i...
Embodiment 2
[0058] Embodiment 2 provides a thermostatically controlled micromechanical resonator. Different from Embodiment 1, the heat insulating frame 2 in Embodiment 2 is a multi-layer nested structure, and the heating beam 1 is composed of a phononic crystal array. composition, the schematic diagram of its plane structure is as follows Figure 10 shown.
[0059] Specifically, the heat insulation frame 2 can be a double-layered nesting, and the heating beam 1 is any one or a combination of a serpentine folded beam, a U-shaped beam or a straight beam formed by a phononic crystal array, The shape of the phononic crystal through hole 4 of the heating beam 1 is a polygon or a circle. This structure further prolongs the distance that the acoustic wave propagates to the substrate silicon wafer 9, and suppresses the transmission of the acoustic wave through the phononic crystal structure, further confining the energy in the resonator 10, thereby further reducing the energy loss of the resona...
Embodiment 3
[0061] Embodiment 3 provides a thermostatically controlled micromechanical resonator, which is different from Embodiment 1 in that the number of the resonant oscillators in Embodiment 3 is two, and the micromechanical resonance can be monitored in real time by means of resonant frequency temperature measurement. The actual temperature change of the overall structure of the resonator, and the resonant frequency temperature measurement uses the frequency difference between the two resonators to measure the temperature of the dual resonators. The temperature control principle based on the dual resonator frequency difference temperature measurement method is shown in the figure. Figure 11 shown. A heating positive voltage V can be applied between the two said thermometric electrodes located on one side of the micromechanical resonator structure h+ , apply a heating negative voltage V between the two temperature measuring electrodes on the other side h- , the heating function can...
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