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Ultraviolet curing adhesive with high temperature resistance and preparation method thereof

A technology of ultraviolet light and curing glue, which is applied in the direction of non-macromolecular organic compound adhesives, adhesives, adhesive additives, etc., can solve the problems of inability to maintain adhesive performance, easy to fall off, etc., and achieve high cross-linking degree and increase High temperature resistance, the effect of excellent high temperature resistance

Pending Publication Date: 2022-08-05
长春艾德斯新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem that the existing ultraviolet light curing adhesive cannot maintain the bonding performance under high temperature conditions and is prone to fall off during the production process, the present invention provides a high temperature resistant ultraviolet light curing adhesive and its preparation method

Method used

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  • Ultraviolet curing adhesive with high temperature resistance and preparation method thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0026] A UV-curable adhesive with high temperature resistance in this embodiment, the raw material includes the following components and contents: 70 parts of acrylate prepolymer, which contains 60% hydroxyl silicone modified acrylate and 40% acrylate Methacrylate type liquid isoprene rubber (UC102); 10 parts of active monomer LA (lauryl acrylate); 3 parts of photoinitiator 184 (1-hydroxycyclohexyl benzophenone); silane coupling agent KH5701 parts ; Antioxidant 10100.5 parts.

[0027] The UV-curable adhesive with high temperature resistance described in Preparation Example 1 is:

[0028] Add the acrylate prepolymer, active monomer, photoinitiator and auxiliary agent into the double planetary power mixing kettle according to the weight ratio, stir and disperse for 2.5h at the stirring speed of 500r / min, and then stir and disperse at the speed of 5000r / min. Centrifugal defoaming under the same centrifugal conditions to obtain UV-curable adhesive, which can be sealed and package...

Embodiment 2

[0030] A UV-curable adhesive with high temperature resistance in this embodiment, the raw material includes the following components and contents: 70 parts of acrylate prepolymer, which contains 60% aminoorganosilicon modified acrylate and 40% Methacrylate type liquid isoprene rubber (UC102); 10 parts of active monomer LA (lauryl acrylate); 3 parts of photoinitiator 184 (1-hydroxycyclohexyl benzophenone); silane coupling agent KH5701 parts ; Antioxidant 10100.5 parts.

[0031] The UV-curable adhesive with high temperature resistance described in Preparation Example 2 is:

[0032] Add the acrylate prepolymer, active monomer, photoinitiator and auxiliary agent into the double planetary power mixing kettle according to the weight ratio, stir and disperse for 2.5h at the stirring speed of 500r / min, and then stir and disperse at the speed of 5000r / min. Centrifugal defoaming under the same centrifugal conditions to obtain UV-curable adhesive, which can be sealed and packaged.

Embodiment 3

[0034] The raw material of the UV-curable adhesive with high temperature resistance in this embodiment includes the following components and contents: 70 parts of acrylate prepolymer, which contains 60% alkoxy silicone modified acrylate and 40% methacrylate type liquid isoprene rubber (UC102); 10 parts of active monomer LA (lauryl acrylate); 3 parts of photoinitiator 184 (1-hydroxycyclohexyl benzophenone); silane coupling agent KH5701 parts; antioxidant 10100.5 parts.

[0035] The UV-curable adhesive with high temperature resistance described in Preparation Example 3 is:

[0036] Add the acrylate prepolymer, active monomer, photoinitiator and auxiliary agent into the double planetary power mixing kettle according to the weight ratio, stir and disperse for 2.5h at the stirring speed of 500r / min, and then stir and disperse at the speed of 5000r / min. Centrifugal defoaming under the same centrifugal conditions to obtain UV-curable adhesive, which can be sealed and packaged.

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Abstract

The invention discloses an ultraviolet curing adhesive with high temperature resistance and a preparation method of the ultraviolet curing adhesive, and belongs to the technical field of preparation of photocuring materials. The technical problems that an existing ultraviolet curing adhesive cannot keep the adhesive performance under the high-temperature condition and is prone to falling off in the production process are solved. The ultraviolet curing adhesive comprises an acrylate prepolymer, an active monomer, a photoinitiator and an auxiliary agent. Wherein the acrylic acid prepolymer is a mixture of organic silicon modified acrylate and methacrylate type liquid isoprene rubber. According to the invention, a manner of modifying acrylate is adopted, a group structure with high temperature resistance is introduced into an acrylate prepolymer, and the modified acrylate and methacrylate isoprene are blended according to a certain proportion, so that the prepolymer with excellent high temperature resistance is prepared; by optimizing the formula, the ultraviolet curing adhesive which can still keep good adhesive performance in a high-temperature environment is obtained.

Description

technical field [0001] The invention belongs to the technical field of preparation of light-curing materials, in particular to a preparation method of an ultraviolet light-curing adhesive with high temperature resistance. Background technique [0002] Due to its fast curing speed, environmental friendliness, low energy consumption, no solvent volatilization, lower system cost, and high safety performance, UV-curable adhesives are constantly expanding in the application fields of mobile phones, TVs, computers and other electronic products. The amount and scope of use are also getting wider and wider. However, UV-curable adhesives also have their own limitations. The existing conventional UV-curable adhesives have obvious limitations in the application of high temperature. adhesive properties. As for the process protection of high-performance tempered glass (such as mobile phone glass, etc.) and the laser engraving process of mobile phone metal back cover, special processes ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/06C09J4/02C09J11/06
CPCC09J4/06C09J11/06Y02P20/10
Inventor 杨瑞冬孙会娟栾雪
Owner 长春艾德斯新材料有限公司
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