Novel indium-based efficient heat-conducting gasket

Abstract

According to the novel indium-based efficient heat-conducting gasket, indium metal and indium-bismuth-tin alloy are adopted as materials of the heat-conducting gasket, the indium metal and the indium-bismuth-tin alloy are rolled into a square metal sheet, and the dam-shaped heat-conducting gasket with the indium-bismuth-tin alloy on the upper surface and the lower surface is manufactured through cutting, overlapping and pressurizing. By reducing the gaps between the heat-conducting gasket and the chip and the radiator, the contact thermal resistance is reduced, and the requirement for higher-power heat dissipation is met.

Description

Technical field [0001] The present invention belongs to the C22C28 / 00 technology field, which involves a new type of pyrine -based high -efficiency thermal conductivity. Background technique [0002] The pyrine is a metal pad that is commonly used in the electronics field as a heat -conducting pads between the chip and the radiator. However, in the actual use process, due to the fact that there is a convex and concave contact point on the solid surfaces such as the interconnected chips, slices, and radiator. Therefore The air can cause the contact thermal resistance to the high state, reducing the distribution effect of the chip heat. [0003] China Patent CN105400497A revealed a metal thermal conductivity, which reproduces a variety of metals, made into a semi -solid state at a normal temperature. The melting point is 45 ° C and has good viscosity and liquidity. The gap, but the wetability of the thermal cream and the thermal interface material is poor. A kind of liquid metal co...

AI Technical Summary

Problems solved by technology

However, in actual use, since there are actually convex and concave contact points on solid surfaces such as chips, indium sheets, and heat sinks that are in contact with each other, there will be a large number of gaps between the indium sheet, the heat sink, and the chip. Air will cause the contact thermal resistance to be in an extremely high state, reducing the heat dissipation effect of the chip

[0003] Chinese patent CN105400497A discloses a metal thermal paste, compounding various metals to make a semi-solid thermal paste at room temperature, with a melting point of 45°C and good viscosity and fluidity, which reduces the friction between the surfaces of thermal interface materials. voids, but the thermal paste has poor wettability with the thermal interface material

Chinese patent CN112898929A discloses a liquid metal composite thermal interface material. In order to prevent liquid metal from leaking during use, additives such as curing agent and coupling agent are added, but the addition of additives is equal to the introduction of liquid metal into the liquid metal. Impurities, which reduce the heat transfer effect of the liquid metal

Chinese patent CN204369797U discloses a metal heat conduction gasket, using copper mesh as a metal mesh for fixing the indium-bismuth-tin alloy, reducing the phenomenon of indium-bismuth-tin alloy overflow during the use of the heat conduction gasket, but it does not solve the problem of heat conduction gasket and Problems with voids on chip and heat sink surfaces

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