Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for mfg. electronic elements and apparatus for mfg. film

A manufacturing method and technology for electronic components, which are applied in the directions of electrical components, spraying devices, spraying devices, etc., can solve the problems of reducing the reliability of electronic components, lowering the film-forming efficiency of the device, and reducing the

Inactive Publication Date: 2005-03-02
PANASONIC CORP
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, the yield of electronic components produced by the above-mentioned method is reduced due to cracks and the like that occur when the film laminate is separated from a support such as a roll.
Moreover, such cracks can significantly reduce the reliability of electronic components
In addition, in order to separate the thin film laminate from the support, it is necessary to stop the operation of the device, and every time the vacuum environment is broken, the film formation efficiency of the device is reduced.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for mfg. electronic elements and apparatus for mfg. film
  • Method for mfg. electronic elements and apparatus for mfg. film
  • Method for mfg. electronic elements and apparatus for mfg. film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] use figure 1 The apparatus shown produces laminates for capacitors.

[0048] An evaporated film of aluminum as a metal film and an acrylic resin film produced by vaporization by electric heating as a dielectric film are formed on the roll 7 . At this time, the resin film is irradiated with ultraviolet rays to harden it, and the metal film is patterned into a predetermined shape by oil-limited patterning. After stacking to a predetermined number of layers, the laminate is separated from the drum 7 to obtain the following: figure 2 The laminated base element 20 shown is subjected to post-processing such as cutting and forming of external electrodes, to form a capacitor. image 3 A schematic diagram showing the cross-sectional structure pattern of the manufactured capacitor.

[0049] The aluminum thin film had a thickness of 50 nm, and the resin thin film had a thickness of 1 μm. As the resin material, a mixture of 1.9 nonanediol diacrylate and 5 wt % photoreinitiato...

Embodiment 2

[0056] use figure 1 The apparatus shown produces laminates for capacitors.

[0057] An evaporated film of aluminum as a metal film and an acrylic resin film produced by gasification by electric heating as a dielectric film are formed on the roller 7 . At this time, the resin film is irradiated with ultraviolet rays to harden it, and the metal film is patterned in a predetermined shape by an oil patterning method. After stacking to a predetermined number of stacks, the laminate is separated from the drum 7 to obtain figure 2 The multilayer parent element shown in the figure is further processed by cutting, forming external electrodes, etc., to obtain a capacitor. image 3 A schematic diagram showing a schematic cross-sectional structure of a manufactured capacitor.

[0058] The aluminum thin film had a thickness of 50 nm, and the resin thin film had a thickness of 1 μm. As the resin material, a mixture of 1.9 nonanediol diacrylate and 5 wt % photoreinitiator was used. Th...

Embodiment 3

[0060] use figure 1 The apparatus shown produces laminates for capacitors.

[0061] An evaporated copper film as a metal film and an acrylic resin film produced by vaporization by electric heating as a dielectric film are formed on the roll 7 . At this time, the resin film is irradiated with ultraviolet rays to harden it, and the metal film is patterned into a predetermined shape by oil-limited patterning. After stacking to a predetermined number of layers, the laminate is separated from the drum 7 to obtain the following: figure 2 The laminated base element 20 shown is subjected to post-processing such as cutting and forming of external electrodes, to form a capacitor. image 3 A schematic diagram showing the cross-sectional structure pattern of the manufactured capacitor.

[0062]The copper thin film had a thickness of 40 nm, and the resin thin film had a thickness of 0.1 μm. As the resin material, dimethanol tricyclodecane diacrylate was used. Copper thin film and re...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

In a method for manufacturing electronic parts by laminating metal thin films and insulating thin films on a support, a mold releasing agent is applied to the support before the start of lamination. Alternatively, the mold releasing agent is applied to the surface of the laminate during the lamination step, and then lamination is resumed. Therefore, the laminate can be prevented from cracking when the laminate is separated from the support or divided into plural pieces in the lamination direction. Thus, the reliability and productivity of electronic parts improve.

Description

technical field [0001] The present invention relates to a method for manufacturing electronic components and a device for manufacturing thin films. Background technique [0002] Membranes function in a very wide range of ways in modern society. Films are used in various aspects of everyday life such as wrapping paper, magnetic tape, capacitors, and semiconductors. Without these thin films, it is impossible to speak of the fundamental developments in high performance and miniaturization technologies in recent years. Meanwhile, in order to meet the needs of industry, various studies have been conducted on methods of forming thin films. For example, for packaging paper, magnetic tape, capacitors, etc., the continuous roll vacuum evaporation method that is conducive to rapid mass production is adopted. [0003] At this time, in order to form a thin film, while selecting the evaporation material and the substrate material, the reaction gas can be introd...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/33H01G4/18H01G4/30H03H3/00
CPCH03H3/00H01G4/308C23C14/22B05B1/24
Inventor 本田和义越后纪康砂流伸树小田桐优
Owner PANASONIC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com