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Ceramic raw wafer manufacturing method and multilayer ceramic electronic parts manufacturing method

A technology of ceramic green sheets and multi-layer ceramics, applied in the field of multi-layer ceramic electronic components and the manufacture of multi-layer ceramic electronic components, can solve the problems of electrode step delamination, extension electrode bending, short-circuit failure, etc., to improve durability, reduce Effect of small surface roughness

Inactive Publication Date: 2005-04-06
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] However, if the number of laminations is not less than 300, the step formed by the thickness of the inner electrode increases, causing the problem of delamination caused by the step of the electrode and the problem of bending of the extended electrode part, which causes a short circuit by connecting the inner electrode to the outer electrode. Fault

Method used

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  • Ceramic raw wafer manufacturing method and multilayer ceramic electronic parts manufacturing method
  • Ceramic raw wafer manufacturing method and multilayer ceramic electronic parts manufacturing method
  • Ceramic raw wafer manufacturing method and multilayer ceramic electronic parts manufacturing method

Examples

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no. 1 example

[0100] In this example, the fabrication of a ceramic green sheet for forming a dielectric layer of a monolithic ceramic capacitor is described as an example.

[0101] (1) First, a predetermined amount of ceramic powder (barium titanate ceramic powder) as a raw material and an additive for improving properties are weighed and mixed at a humidity level to form a mixed powder. Each additive is added to the ceramic powder in the form of oxide powder or carbonate powder, and the resulting mixture is wet-distributed in an organic solvent (dispersion solvent).

[0102] As a method of wet distribution (primary spreading), it is preferable to select a spreading method or spreading conditions in which ceramic powder is not ground. That is, it is preferable to disperse under the condition that the generated shearing force does not cause grinding.

[0103] Examples of the dispersion method include a ball milling method, a sand mixing method, a stick milling method, a high-pressure homoge...

no. 2 example

[0230] In this example, describe Figure 5 Fabrication of monolithic ceramic capacitors of the structure shown.

[0231] Figure 5 The monolithic ceramic capacitor 1 is a sheet-like monolithic ceramic capacitor, in its structure, a rectangular laminate 3 includes a ceramic layer 2 serving as a dielectric layer and alternately stacked first and second internal electrodes 8 and 9 , the first and second external electrodes 6 and 7 are disposed on the first and second end faces 4 and 5 of the laminate 3, and are connected to the first and second internal electrodes 8 and 9, respectively. On the external electrodes 6 and 7, first plating layers 10 and 11 and second plating layers 12 and 13 are formed, respectively.

[0232] A method of manufacturing a monolithic ceramic capacitor is described below.

[0233] (1) First, the raw material of dielectric ceramics, a predetermined amount of ceramic raw material powder such as barium titanate, and additives for improving properties are...

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Abstract

The invention is to stably produce a ceramic green sheet having good surface roughness and few pinhole defects, and efficiently manufacture a multilayer ceramic electronic part in which deterioration of its life and the occurrence of structural defects to be suppressed. A dry sheet obtained by forming ceramic slurry to a sheet on a carrier film is smoothed by pressing using a plate press, a hydrostatic press or a calender roll under predetermined temperature and pressure conditions to improve the surface smoothness of the ceramic green sheet independently of the particle diameter of the ceramic and its dispersibility. An electrode paste is coated in a predetermine pattern on the thus-produced ceramic green sheet to form a sheet provided with an electrode. A plurality of the sheets provided with electrodes are laminated, and the burned to produce a multilayer ceramic electronic part.

Description

technical field [0001] The present invention relates to a method for producing ceramic green sheets for producing multilayer ceramic electronic components such as monolithic ceramic capacitors and multilayer varistors. The invention also relates to a multilayer ceramic electronic component, in particular to a method of producing a multilayer ceramic electronic component in which a plurality of internal electrodes are arranged in ceramic with a ceramic layer arranged therebetween. Background technique [0002] Although monolithic ceramic capacitors, which are typical examples of multilayer ceramic electronic parts, have been widely used in various applications, recently, monolithic ceramic capacitors have been increasingly required to have a small size and a large capacity as electronic parts are miniaturized. [0003] Such as image 3 As shown, in the monolithic ceramic capacitor structure, the ceramic element 3 includes a plurality of internal electrodes 2a and 2b facing ea...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/00H01C7/18H01C17/065H01G4/12H01G4/30
CPCH01C7/18H01G4/12H01C7/003H01G4/30H01C17/06506
Inventor 山名毅宫崎孝晴
Owner MURATA MFG CO LTD
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