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Flexible circuit base board and its manufacturing method

A circuit substrate and manufacturing method technology, applied in the direction of circuit substrate materials, printed circuit components, chemical instruments and methods, etc., can solve problems such as cumbersome processes, and achieve the effect of simple processes

Inactive Publication Date: 2005-07-13
黄堂杰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the PI film must be pre-treated with plasma (Plasma) before sputtering to ionize the oxygen on the PI surface, and the process is relatively cumbersome.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Embodiment 1: The structure of the flexible circuit substrate in this embodiment is a polymer film layer, a chromium adhesion layer, a nickel-chromium alloy adhesion layer, a copper adhesion layer and a copper foil layer in sequence, and its manufacturing process steps are as follows:

[0014] Step 1: Use the film made of PI as the substrate, with an area of ​​10cm×10cm, use 20cm×20cm of chromium material as the sputtering target, the distance between the target and the PI film is 20cm, the sputtering current is 1.0A, and Ar gas is used as the sputtering target. Sputtering gas, sputtering gas pressure 5×10 -3 atm, sputtering gas flow rate 2×10 -3 torr, sputtering time 1min, sputtering a chromium adhesion layer on the surface of the PI side, the thickness of the chromium adhesion layer is less than 1μm;

[0015] Step 2: The sputtering process conditions are the same as step 1, the sputtering target material is a nickel-chromium alloy material, and a nickel-chromium allo...

Embodiment 2

[0019] Example 2: PET is used as the polymer film layer, and the rest are the same as in Example 1. The peel strength of the manufactured flexible circuit substrate reaches 1.0 kgf / cm.

Embodiment 3

[0020] Embodiment 3: the composition of flexible circuit substrate is PI macromolecule thin film layer, chromium adhesion layer, nickel-chromium alloy adhesion layer, nickel adhesion layer, copper adhesion layer and copper foil layer in sequence, sputtering and electroplating in its manufacturing process Condition is the same as embodiment 1, compared with embodiment 1, present embodiment sputters a nickel adhesion layer more between the nickel-chromium alloy adhesion layer and the copper adhesion layer, utilizes the expansion coefficient of nickel material to be between nickel-chromium alloy and copper Between the expansion coefficients, the bonding force between the material layers is strengthened, and the peel strength is greater than 1.0kgf / cm.

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PUM

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Abstract

The invention relates to a flexible circuit substrate and a manufacturing method thereof. A polymer film layer and a metal, nickel alloy and copper adhesion layer sequentially bonded on one side surface of the polymer film layer are set. The manufacturing method of the substrate is as follows: 1) taking the polymer film as the base material and the metal as the sputtering target material, and sputtering the metal adhesion layer on one side of the polymer film layer; 2) using the nickel alloy as the target material, A nickel alloy adhesion layer is sputtered on the surface of the nickel alloy adhesion layer; 3) Copper is used as a target material, and a copper adhesion layer is sputtered on the nickel alloy adhesion layer. A nickel-chromium alloy layer is added between the chromium sputtering layer and the copper sputtering layer on the substrate, because the expansion coefficient of chromium and nickel is 6.5×10 -6 , 13.3×10 -6 , The expansion coefficient of the alloy material is between the two, which is closer to the expansion coefficient of copper than the pure chromium material, so the bonding force between the sputtered layers is stronger, and the peel strength is greater than 1.0kgf / cm. Moreover, the polymer film does not need pretreatment, and the process is simple.

Description

(1) Technical field [0001] The invention relates to a printed circuit board, in particular to a flexible circuit board and a manufacturing method thereof. (2) Background technology [0002] In order to meet the miniaturization, light weight, high performance and strict requirements of reliability of electronic products, the development and design of flexible circuit boards have gradually attracted attention. Existing flexible circuit substrates can be roughly divided into three-layer and two-layer types. 1) The manufacturing process of the so-called three-layer flexible circuit board is a film made of a polymer plastic material such as Polyimide (abbreviated as PI) or polyester (Polyester, abbreviated as PET). One side surface of the type polymer film layer is coated with an adhesive, and then laminated with a layer of calendered copper foil layer to form a three-layer structure. The thickness of the adhesive in the interlayer is about 12.5-25 μm, using acrylic (Acrylate) ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/08C23C14/20C23C14/34H05K1/05
Inventor 黄堂杰
Owner 黄堂杰