Epoxy adhesive capable of using at ultralow-temp. and its preparation and application method
An epoxy adhesive, extremely low temperature technology, applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve problems such as roughness, uneven surface shape, etc., and achieve the effect of lower price and high tensile and shear strength
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Examples
Embodiment 1
[0037] First put 30-50 parts (weight) of low-molecular-weight polyamide into the reactor, heat at 30-50°C and vacuumize for 2-5 hours, add 5-20 parts (weight) of nitrile rubber and stir to raise the temperature to 70-100°C, react for 1-4 hours, then slowly lower the temperature by 5-20°C / hour, release the vacuum when the temperature drops to room temperature, take out the composite toughening agent, and set aside.
[0038] 80 grams of E-44 epoxy resin, 60 grams of low-molecular polyamide with toughening are used as curing agent, 20 grams of low-molecular polyamide and nitrile rubber composite are used as toughening agent, and 60 grams of ultrafine silicon dioxide Mix well as enhancer.
[0039] When it is used for flattening and pasting the surface of the low-temperature radiation-proof nitrogen screen in the superconducting fusion device, the steps and conditions are:
[0040] (1) Clean the surface of the copper nitrogen screen, degrease and clean the surface of the copper ni...
Embodiment 2
[0046] 140 grams of E-44 epoxy resin, 100 grams of low-molecular polyamide with toughening are used as curing agent, 50 grams of low-molecular polyamide and nitrile rubber composite are used as toughening agent, and 60 grams of ultrafine silicon dioxide The epoxy adhesive prepared as reinforcing agent is painted on the surface of the cleaned copper nitrogen screen, which is actually the same as that in Example 1.
Embodiment 3
[0048] 100 grams of E-44 epoxy resin, 80 grams of low-molecular-weight polyamide with toughening are used as curing agent, 30 grams of low-molecular-weight polyamide and nitrile rubber compound are used as toughening agent, and 60 grams of ultrafine silicon dioxide The epoxy adhesive prepared as reinforcing agent is painted on the surface of the cleaned copper nitrogen screen, which is actually the same as that in Example 1.
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Abstract
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