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Epoxy adhesive capable of using at ultralow-temp. and its preparation and application method

An epoxy adhesive, extremely low temperature technology, applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve problems such as roughness, uneven surface shape, etc., and achieve the effect of lower price and high tensile and shear strength

Inactive Publication Date: 2005-11-30
INST OF PLASMA PHYSICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of this invention is to solve the technical problems of using ordinary epoxy at extremely low temperature and using epoxy adhesive to paste mirror aluminum foil under the condition of irregular and rough surface

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] First put 30-50 parts (weight) of low-molecular-weight polyamide into the reactor, heat at 30-50°C and vacuumize for 2-5 hours, add 5-20 parts (weight) of nitrile rubber and stir to raise the temperature to 70-100°C, react for 1-4 hours, then slowly lower the temperature by 5-20°C / hour, release the vacuum when the temperature drops to room temperature, take out the composite toughening agent, and set aside.

[0038] 80 grams of E-44 epoxy resin, 60 grams of low-molecular polyamide with toughening are used as curing agent, 20 grams of low-molecular polyamide and nitrile rubber composite are used as toughening agent, and 60 grams of ultrafine silicon dioxide Mix well as enhancer.

[0039] When it is used for flattening and pasting the surface of the low-temperature radiation-proof nitrogen screen in the superconducting fusion device, the steps and conditions are:

[0040] (1) Clean the surface of the copper nitrogen screen, degrease and clean the surface of the copper ni...

Embodiment 2

[0046] 140 grams of E-44 epoxy resin, 100 grams of low-molecular polyamide with toughening are used as curing agent, 50 grams of low-molecular polyamide and nitrile rubber composite are used as toughening agent, and 60 grams of ultrafine silicon dioxide The epoxy adhesive prepared as reinforcing agent is painted on the surface of the cleaned copper nitrogen screen, which is actually the same as that in Example 1.

Embodiment 3

[0048] 100 grams of E-44 epoxy resin, 80 grams of low-molecular-weight polyamide with toughening are used as curing agent, 30 grams of low-molecular-weight polyamide and nitrile rubber compound are used as toughening agent, and 60 grams of ultrafine silicon dioxide The epoxy adhesive prepared as reinforcing agent is painted on the surface of the cleaned copper nitrogen screen, which is actually the same as that in Example 1.

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PUM

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Abstract

The present invention relates to an epoxy adhesive used at very low temp., its preparation method and application method. It is prepared by adopting toughened low-molecular polyamide as solidifying agent, toughened lkow-molecular polyamide and nitrile rubber synthetic compound as toughening agent and ultra-fine silicon micropowder as reinforcing agent. Said invented epoxy adhesive can be used for level-coating and sticking low-temp. radiation-proofing nitrogen screen surface in superconducting fusion equipment.

Description

field of invention [0001] The invention relates to an epoxy adhesive used at extremely low temperature, which is used to bond aluminum foil on a radiation-proof copper nitrogen screen at very low temperature, and is used in similar low-temperature radiation-proof devices such as magnetic confinement fusion physics experiment devices. Background technique [0002] In order to ensure the operation stability of superconducting magnets, increase the cooling speed of magnets, and prevent the influence of ambient temperature radiation on superconducting magnets in superconducting fusion devices, the inner and outer vacuum chambers of the device are equipped with inner and outer nitrogen screens and mirror aluminum foil to prevent heat radiation. . The inner and outer nitrogen screens are explosively formed by copper plates. The surface shape is irregular and rough. It needs to be coated with epoxy adhesive and then pasted with aluminum foil with a mirror surface. Common adhesives...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00
Inventor 陈强高秉钧陈敬林
Owner INST OF PLASMA PHYSICS CHINESE ACAD OF SCI