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Photosensitive insulation paste and thick film multilayer circuit substrate

A technology of circuit substrate and insulating paste, which is applied in the direction of multi-layer circuit manufacturing, circuit substrate material, circuit, etc., can solve the problem of increasing the limit of quality factor value, and achieve the effect of increasing density

Inactive Publication Date: 2006-02-22
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, materials with low dielectric constants (typically, such as alumina-borosilicate glass-ceramic materials) have limitations in increasing the figure of merit value

Method used

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  • Photosensitive insulation paste and thick film multilayer circuit substrate
  • Photosensitive insulation paste and thick film multilayer circuit substrate
  • Photosensitive insulation paste and thick film multilayer circuit substrate

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0069] Appropriate amount of borosilicate glass powder and crystalline SiO 2 The powders were blended so as to obtain the respective ingredients in Table 2, and the obtained mixture was wet-mixed by using a zirconia ball mill for 3 to 4 hours, so as to obtain borosilicate glass powder and crystalline SiO 2 Powder a homogeneous powder mixture. Then, an organic binder and an organic solvent (toluene) were added to the powder mixture, and then sufficiently stirred by using a ball mill so as to obtain uniform dispersion. In addition, the dispersion thus obtained was degassed under reduced pressure, whereby a slurry for making a green sheet was obtained.

[0070] The green sheet slurry thus obtained was applied to a film with a doctor blade, whereby a green sheet having a thickness of 0.2 mm was formed. The green sheet is dried, and the film is peeled off and punched, thereby obtaining a ceramic green sheet of a predetermined size.

[0071] Table 2

...

example 2

[0078] Table 4

[0079] Mix borosilicate glass powder and crystalline SiO in appropriate amounts 2 , so as to obtain the following ingredients: borosilicate glass powder / crystalline SiO 2 powder 60 / 40 (wt.%), and the resulting mixture was wet-mixed for 3 to 4 hours by using a zirconia ball mill, so as to obtain borosilicate glass powder and crystalline SiO 2 Homogeneous powder mixture of powder. Then, an organic binder and an organic solvent (toluene) were added to the powder mixture, which was then thoroughly stirred by using a ball mill so as to obtain uniform dispersion. In addition, the dispersion thus obtained was degassed under reduced pressure, thereby obtaining a slurry of a green sheet.

[0080] The green sheet slurry thus obtained was applied to a film by using a doctor blade, thereby forming a green sheet having a thickness of 0.2 mm. The green sheet is dried, the film is removed, and punched, whereby a ceramic green sheet of a predetermined size is ob...

example 3

[0089] Get SiO 2 , B 2 o 3 and K 2 O as a starting material for the preparation of borosilicate glass powder contained in a photosensitive insulating paste and mixed in an appropriate amount so as to obtain the following composition: SiO 2 / B 2 o 3 / K 2 O=79 / 19 / 2 (wt.%). The resulting mixture is melted at 1500 to 1700 degrees Celsius to obtain molten glass. The molten glass was quenched using a quenching roller and a base, whereby borosilicate glass powder having an average particle size of 3.0 μm was obtained. Simultaneously, the crystalline SiO was ground in a ball mill 2 powder, resulting in SiO with an average particle size of 3.0 μm 2 powder. In addition, the thus obtained borosilicate glass powder and crystalline SiO are sprayed in a high-temperature atmosphere 2 powder and quench.

[0090] In this case, the number of quenching steps was varied in the range from 1 to 5, whereby borosilicate glass powder and crystalline SiO 2 powder, which has a different sha...

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Abstract

A photosensitive insulating paste contains a borosilicate glass powder and a crystalline SiO2 powder, wherein the powders are dispersed in a photosensitive organic vehicle and the paste contains the crystalline SiO2 component in an amount of about 3-40 wt. % after sintering. A thick-film multi-layer circuit substrate (e.g., chip inductor) comprising an insulating substrate on which insulating layers are formed, wherein the insulating layers are formed through exposure, development and sintering, after the application of the photosensitive insulating paste.

Description

technical field [0001] The present invention relates to a photosensitive insulating paste suitable for forming insulating layers in, for example, high-frequency circuits, and to a thick-film multilayer circuit substrate containing the insulating paste. Background technique [0002] As high-frequency electronic devices including portable terminals and computers have achieved higher densities and higher signal speeds, insulating materials used in high-frequency circuits or similar components of devices are required to have lower relative permittivity and higher High quality factor values. Such insulating materials are mainly used to form insulating layers which separate two or more electrodes or transmission lines in electronic components such as high-frequency circuit substrates or high-frequency circuits. [0003] Generally, the insulating layer is formed of insulating paste containing glass powder or the like. The insulating layer often contains vias in the form of microv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004H01B3/00H05K1/09H05K3/46C03C8/14C03C8/16H01B3/08H05K1/03H05K3/00
CPCY10T428/252Y10T428/259Y10T428/24926H05K3/0023C03C8/14G03F7/0047H05K3/4667C03C8/16H05K1/0306
Inventor 户濑诚人川上弘伦渡边静晴
Owner MURATA MFG CO LTD