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Polishing slurry comprising silica-coated ceria

A silica, ceria technology, applied in polishing compositions containing abrasives, transportation and packaging, other chemical processes, etc., can solve the poor dispersion of ceria particles, unsatisfactory long-term storage stability, deterioration Polishing performance, etc.

Inactive Publication Date: 2007-01-17
SAMSUNG CORNING PRECISION MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, when compared to other abrasive particles such as silica and alumina, ceria particles tend to agglomerate easily and thus have poor dispersibility and unsatisfactory performance in aqueous slurry systems. Long-term storage stability, resulting in deteriorated polishing performance

Method used

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  • Polishing slurry comprising silica-coated ceria
  • Polishing slurry comprising silica-coated ceria
  • Polishing slurry comprising silica-coated ceria

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-3

[0046] The silica-coated ceria particles obtained in Preparation 1-3 were dispersed into deionized water in an amount of 1% by weight using a particle impact dispersing device to obtain a polishing slurry (pH 7) of the present invention.

Embodiment 4

[0050] Using a particle impact dispersing device, the silica-coated ceria particles obtained in Preparation 1-3 were dispersed into deionized water at an amount of 1% by weight to obtain a ceria slurry (pH value was 10), and coated with Based on the particles, 1% by weight of ammonium polyacrylate (Darvan 821A, a product of R.T. Vandervilt) was added thereto to obtain the polishing slurry of the present invention.

Embodiment 5

[0052] The procedure of Example 4 was repeated, except that based on the coated particles, 10% by weight of triethylamine was further added to obtain the polishing slurry of the present invention.

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PUM

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Abstract

A polishing slurry composition for CMP comprising 0.5 to 5% by weight of a silica-coated ceria powder dispersed in an aqueous medium can be beneficially used in the planarization of the surfaces of various film layers of semi-conductors and electro-luminescent devices.

Description

technical field [0001] The present invention relates to a polishing slurry composition comprising silica-coated ceria (CeO 2 )powder. Background technique [0002] Chemical mechanical polishing (CMP) is a method for planarizing (palnarizing) inorganic or organic layers of various devices through the chemical and mechanical action of a polishing agent, which conventionally uses metal oxides such as silicon dioxide (SiO 2 ), alumina (Al 2 o 3 ), ceria (CeO 2 ), zirconia (ZrO 2 ) and titanium dioxide (TiO 2 ) as a polishing agent in the form of an aqueous slurry. [0003] In the field of semiconductor or electroluminescent device manufacturing technology, ceria has recently been used for the leveling of thin film layers due to its good hardness and polishing properties. [0004] For example, US 6238450 discloses a polishing slurry for polishing optical or semiconductor surfaces comprising a BET surface area of ​​at least 10 m 2 / g of ceria powder and optionally other ab...

Claims

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Application Information

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IPC IPC(8): C09K3/14B24B37/00C09G1/02H01L21/304H01L21/3105
CPCH01L21/31053C09K3/1409Y10T428/325C09G1/02C09K3/1436C09K3/1445C09K3/14
Inventor 李鳞渊金尚太赵允珠朴商圭金炅俊
Owner SAMSUNG CORNING PRECISION MATERIALS CO LTD