Informaton recording thin film material and its prepn. method
A technology for information recording and thin film materials, applied in the field of film materials, can solve the problems of difficult to effectively control the thin film manufacturing process, uneven distribution of magnetic powder, low magnetic recording density, etc., to improve reliability and information transmission speed, low manufacturing cost , the effect of a wide range of applications
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Embodiment 1
[0025] The aluminum-magnesium alloy disc (i.e. the substrate) with a central hole is used as the substrate, and polished to achieve a lower surface roughness. On the aluminum-magnesium alloy substrate, a layer of NiP alloy layer is first deposited by electroless plating. The structure of a coating is amorphous and not ferromagnetic. Then, after further polishing the NiP alloy layer, a film of iron with a thickness of 100 nanometers is deposited on the NiP alloy layer of the wafer by electroplating, and a magnetic field is applied in the electroplating tank to make the magnetic material in the deposition process. Get the pole orientation. Then cover the ferromagnetic film of the wafer with photoresist, and then use a CD recorder to expose and record all the information recording positions on the wafer. The photoresist that has been exposed to light will harden and form spots, while the part that is not exposed to light will remain the same , and then develop the wafer with spo...
Embodiment 2
[0028] This embodiment is the same as Embodiment 1 except the following operating conditions: all operating processes are carried out in a vacuum chamber.
Embodiment 3
[0030] A disc is made of light-transmitting glass, a layer of chrome is plated on the surface of the glass disc, and then the glass disc is coated with photoresist to make a recordable disc; Expose and record the spot array at the information recording position; then develop and etch the glass wafer to make a mask.
[0031] The aluminum-magnesium alloy wafer is used as the substrate and polished to achieve extremely low surface roughness. On the aluminum-magnesium alloy substrate, a layer of NiP alloy layer is first deposited by electroless plating. The structure of this coating is amorphous. Not ferromagnetic. Then after the NiP alloy layer is further polished, on the NiP alloy layer of the wafer, adopt the method deposition of electroplating (the method for electrolytic deposition) one deck of 100 nanometers thick iron film, apply magnetic field in the electroplating tank, so that Magnetic materials acquire a magnetic pole orientation during deposition. Then, after the fer...
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