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Production of local vacuum sealing protective structure of silicon based sensor flexible piece

A partial vacuum and sealing protection technology, which is applied in chemical instruments and methods, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., to achieve reliable and stable work

Inactive Publication Date: 2007-05-30
NO 24 RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, there is no report on the production method of the partial vacuum sealing protection structure with interconnection lines on the sealing surface of the movable part.

Method used

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  • Production of local vacuum sealing protective structure of silicon based sensor flexible piece

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Embodiment Construction

[0027] The specific implementation manner of the present invention is not limited to the following description, and the method of the present invention will be further described below in conjunction with the accompanying drawings. The inventive method comprises the following steps:

[0028] 1. Make the silicon cap 6 according to the design pattern of the silicon cap. The specific process steps are:

[0029] (1) Mask the unpolished silicon wafer according to the design pattern of the silicon cap 6 . The method of masking is to use photoresist (such as KPR glue) to mask the part other than the designed silicon cap cavity, exposing the silicon cap cavity.

[0030] (2) Form the silicon cap cavity 8 by chemical etching. Described chemical etching method is to use hydrofluoric acid: ammonium fluoride: water=3ml: 6g: 10ml solution corrodes the silicon dioxide (SiO2) on the surface of the silicon cap cavity. 2 ); then use nitric acid:hydrofluoric acid=10:1 solution to etch silicon ...

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Abstract

A method for preparing vacuum sealed partial protective structure for movable part of silicon based transducer includes preparing silicon cup, preparing metal mask plate according to designed drawing of seal ring, biting seal size on seal ring surface of silicon based transducer chip and sealing silicon cup with seal size under vacuum condition.

Description

(1) Technical field [0001] The invention relates to a method for making a partial vacuum sealing protection structure of a movable part of a silicon-based sensor, which is used for the partial vacuum sealing protection structure when there are interconnection lines on the sealing surface of the movable part of a silicon-based sensor of a microelectronic machine (MEMS). make. (2) Background technology [0002] As we all know, if the micromechanical silicon-based sensor is to work reliably and stably, the protection of the movable parts becomes a necessary condition for reliable and stable operation. The most effective method for the protection of movable parts is to seal the whole or part of the device, and the protection of movable parts is divided into general protection and vacuum sealing protection. The so-called general protection belongs to the integrated circuit packaging methods, such as spot welding, parallel seam welding, solder welding, cold welding and plastic se...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L23/28B81B7/00B81C5/00B81C99/00G01D11/00
Inventor 曾大富刘建华罗弛唐喆
Owner NO 24 RES INST OF CETC