High-frequency circuit board and high-frequency antenna switch module using same

Abstract

A high-frequency circuit board, comprising: a choke coil circuit element of a high-frequency switch circuit; a dielectric laminated structure comprising a plurality of dielectric layers, wherein there are a first dielectric layer and a second dielectric layer; on the first dielectric layer The formed contact area; and the circuit pattern formed on the second dielectric layer, wherein: the above-mentioned choke coil circuit element is mounted on the contact area as a chip inductor; the first dielectric layer is located at the end of the structure; In at least one dielectric layer with a circuit pattern, the second dielectric layer is closest to the above-mentioned first dielectric layer; the contact area is located in the layer formed by extending the circuit pattern formed on the second dielectric layer in the stacking direction of a plurality of dielectric layers outside the area.

Description

technical field [0001] The present invention relates to a high-frequency circuit board that can be used in communication equipment such as a mobile phone, and a high-frequency antenna switch module using the same. Background technique [0002] Hitherto, in communication devices such as mobile phones, for example, a high-frequency switch module has been used to connect a receiving circuit to an antenna or to connect a transmitting circuit to an antenna. This high-frequency switch module is constructed in such a way that some of the circuit elements are formed on a dielectric layer as a dielectric laminated structure (harmonic circuit board) from the viewpoint of reducing the size and weight of the communication equipment itself. The remaining circuit elements are formed on the chip element as composite structural units mounted on the outer surface of the dielectric laminate structure (see Japanese Patent Laid-Open No. 6-204912). [0003] In this well-known high-frequency swi...

AI Technical Summary

Problems solved by technology

Therefore, in order to pattern the stripline on the dielectric layer, it is necessary to use a substrate with a relatively large area. This situation results in that the pattern on the dielectric layer must be set in accordance with the required area when patterning the stripline. The vertical and horizontal dimensions of the laminated body are limited in miniaturization

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