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Multifunctional high frequency integrated circuit structure

A technology of integrated circuits and circuit structures, applied in the direction of electrical components, power oscillators, automatic power control, etc., can solve the problems of program development cost and time delay, etc.

Inactive Publication Date: 2003-03-05
TLC PRECISION WAFER TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This naturally adds expense and time delay to program development

Method used

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  • Multifunctional high frequency integrated circuit structure
  • Multifunctional high frequency integrated circuit structure
  • Multifunctional high frequency integrated circuit structure

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Embodiment Construction

[0017] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] FIG. 1 shows a partial schematic block diagram of a multifunctional high frequency integrated circuit 100 of the present invention, which includes a backplane 110 and a ground plane indicated by numeral 111 . On the backplane 110 are an oscillator element 120, a buffer amplifier circuit 130, a first transmission line strip 140 including a mechanically tunable openstub resonator, and a second transmission line strip 180. Oscillator element 120 acts as a negative resistance in the oscillator circuit. The integrated circuit 100 also includes signal receiving terminal ports 150 and 155, an output port 160, and first and second biasing ports 170 and 190 for receiving first and second biasing potential sources, respectively.

[0019] Integrated circuit 100 is constructed such that bias port 170 is electrically connected to control termination input 121 of oscillator element 120 and to control termination input 131 of...

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Abstract

A multifunction high frequency integrated circuit structure and circuit configuration includes a resonator or oscillator circuit coupled to a buffer amplifier by way of a stripline coupler. The resonator circuit includes an input terminating region which is coupled to three input terminating ports. A first one of the input terminating ports is coupled directly to the resonator for either being electrically connected to a selected signal source or load, a second one of the input terminating ports is electrically connected to either a fixed or variable potential source, and the remaining input terminating port is coupled to the resonator input terminating region through another stripline coupler, and is intended to be electrically connected to another selected signal source. Depending upon the choice of circuit components and signal sources connected to the input terminating ports, the multifunction high frequency integrated circuit may serve as a voltage controlled oscillator, low phase noise oscillator, direct up / down frequency signal converter, or injection locked oscillator.

Description

technical field [0001] The present invention relates to integrated circuits for millimeter-wave and microwave applications, and more particularly to a common circuit configuration that can provide various high-frequency signal functions depending on the connected external components. Background technique [0002] The present invention relates to high-frequency circuit equipment, in particular to millimeter wave and microwave equipment. The current integrated circuit fabrication technology that enables low-cost and low-noise fabrication is called MMIC technology, and is typically a monolithic and composite fabrication process technology. [0003] MMIC high-frequency devices used in the communication and radar fields include basic oscillators, voltage-controlled oscillators, mixers, and frequency converters, as well as injection-locked signal sources with power greater than the injected signal. Each of the aforementioned high frequency devices is known in the art and implemen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03B1/00H03B5/02H03B5/18H03B19/14H03D9/06H03L7/24
CPCH03B5/1852H03D9/0633H03D7/00
Inventor 约翰·J·格迪斯斯特凡妮·M·卡尔森菲利普·陈弗拉迪莫·索科洛夫
Owner TLC PRECISION WAFER TECH
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