Polishing composition for metal CMP
A technology of polishing composition and mixture, which is applied in the direction of polishing composition, polishing composition containing abrasive, composition for inhibiting chemical change, etc., and can solve problems such as difficult polishing and removal
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[0042] This example evaluates the ability of various polishing compositions to polish tantalum layers without affecting the roughness of previously polished copper portions. This slurry uses a CMP slurry comprising 6 weight percent fumed silica with a surface area of 90 m 2 / gram. The pH of the slurry was maintained at 11 under all tests. The different ingredients were added to the base slurry as listed in Table 1 below. Silquest A1524 is ureidopropyltrimethoxysilane manufactured for CKWITCO Corporation. Each slurry was used to polish the Cu layer on the wafer. The polished copper surface roughness (a measure of defectivity) was determined using atomic force microscopy.
[0043] Cu wafers were polished using an IPEC 472 polishing tool using an IC1000 / SUBAIV pad stack made by Rodel. The weights were polished using 3 lbs per square inch aluminum Γ55 rpm turret speed, 30 rpm spindle speed, and 200 ml / min slurry flow rate. The polishing results are reported in Table 1 belo...
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