Heat strippable pressure-sensitive adhesive sheet for electronic element, method for producing electronic element and electronic element

A pressure-sensitive adhesive, pressure-sensitive adhesive layer technology, applied in the direction of bonding methods using foamed adhesives, film/sheet-like adhesives, electrical components, etc., can solve the problem of increased pollution, etc. question

Inactive Publication Date: 2003-10-29
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

i.e., a 10-fold or more incr

Method used

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  • Heat strippable pressure-sensitive adhesive sheet for electronic element, method for producing electronic element and electronic element
  • Heat strippable pressure-sensitive adhesive sheet for electronic element, method for producing electronic element and electronic element
  • Heat strippable pressure-sensitive adhesive sheet for electronic element, method for producing electronic element and electronic element

Examples

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preparation example Construction

[0067] The preparation of the heat-expandable layer can be carried out by, for example, a conventional method comprising mixing heat-expandable microspheres and an adhesive such as a pressure-sensitive adhesive and optional components such as solvents and other additives, and forming the mixture into a sheet-like layer . Specifically, for example, the heat-expandable layer can be prepared by coating a mixture containing heat-expandable microspheres, an adhesive such as a pressure-sensitive adhesive, and optional other components such as a solvent onto a substrate or rubber or apply the mixture to a suitable backing (such as release paper) to form a thermally expandable layer, and transfer this layer to a substrate or a rubbery organic elastic layer. The thermally expandable layer may have a single-layer or multi-layer structure.

[0068] The thickness of the heat-expandable layer can be appropriately selected depending on the desired degree of adhesion reduction and the like....

Embodiment 1

[0125] Add 50 parts by weight of n-butyl acrylate, 50 parts by weight of 2-ethylhexyl acrylate, 5 parts by weight of acrylic acid, 0.1 parts by weight of 2,2'-azobisisobutyronitrile, and 200 parts by weight of ethyl acetate into 500ml Equipped with a thermometer, a stirrer, a nitrogen introduction tube and a three-necked flask with a reflux condenser, so as to obtain a total amount of 200 g. The resulting mixture was stirred for about 1 hour while nitrogen gas was blown thereinto, thereby replacing the air in the reactor with nitrogen gas. After that, the temperature in the reactor was adjusted to 58°C, and the reaction mixture was kept in this state for about 4 hours to conduct polymerization. Thus, an acrylic polymer (often referred to as "acrylic copolymer A") is obtained.

[0126] Add 2 parts by weight of isocyanate crosslinking agent to the ethyl acetate solution containing 100 parts by weight of acrylic copolymer A and prepare the acrylic pressure-sensitive adhesive and...

Embodiment 2

[0130] The same thermally expandable layer as in Example 1 (thickness 40 μm) was formed on one side of a 50 μm thick PET film in the same manner as in Example 1. A non-heat-expandable pressure-sensitive adhesive layer (stain-resistant, radiation-curable adhesive layer) (thickness 2 µm) formed by the method described below was transferred onto the heat-expandable layer. Thus, it is formed as figure 1 Heat-peelable pressure-sensitive adhesive sheet of the construction shown.

[0131] Non-thermally expandable pressure-sensitive adhesive layer B:

[0132] 100 parts by weight of acrylic urethane, 3 parts by weight of isocyanate crosslinking agent and 3 parts by weight of radiation curing initiator (photopolymerization initiator) were added to 100 parts by weight of acrylic type copolymer B and prepared acrylic pressure sensitive The adhesive was applied to the liner at a thickness of 2 μm on a dry basis and allowed to dry. Thus, a non-heat-expandable pressure-sensitive adhesive ...

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Abstract

Disclosed is a heat-peelable pressure-sensitive adhesive sheet for electronic components that is easily peeled off from electronic components with little contamination after heat treatment. The heat-peelable pressure-sensitive adhesive sheet for electronic components includes a heat-expandable layer containing heat-expandable microspheres and a non-heat-expandable pressure-sensitive adhesive layer formed on at least one side of the heat-expandable layer, wherein when When a pressure-sensitive adhesive sheet is applied to the surface of a silicon wafer on one side of the non-heat-expandable pressure-sensitive adhesive layer, and then heated and peeled off from the silicon wafer, the surface of the silicon wafer measured by XPS The ratio RC1 (%) of the carbon element on the surface satisfies at least one of the following relationships (1) and (2): RC1≤50+RC2 (1), RC1≤2.5RSi (2); wherein RC2 represents that it is formed by The ratio (%) of the carbon element on the surface of this silicon wafer measured by XPS; The proportion of silicon element on the surface of the sheet.

Description

technical field [0001] The present invention relates to a heat-peelable pressure-sensitive adhesive sheet for electronic components, which is easily peeled from the electronic components with little contamination after heat treatment. The present invention also relates to a method of processing electronic components using the heat-peelable pressure-sensitive adhesive sheet for electronic components, and to an electronic component produced by the processing method. Background technique [0002] A heat-peelable pressure-sensitive adhesive sheet comprising a substrate and a pressure-sensitive adhesive layer formed thereon containing a blowing agent or a blowing agent, i.e. heat-expandable microspheres is known (see, for example, Japanese Patent Publication 50-13878 and 51-24534 and Japanese Patent Laid-Open Nos. 56-61468, 56-61469 and 60-252681). These heat-peelable, pressure-sensitive adhesive sheets combine adhesion with post-use releasability. Such a pressure-sensitive adh...

Claims

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Application Information

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IPC IPC(8): C09J5/08C09J7/38C09J201/00H01L21/02H01L21/301
CPCC09J5/08C09J2203/326H01L21/6835H01L21/6836H01L2221/68327H01L2221/6834H01L2221/68381C09J7/38C09J2301/208C09J2301/412C09J2301/502H01L21/60
Inventor 木内一之川西道朗
Owner NITTO DENKO CORP
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