Micropattern forming material and fine structure forming method

A micro-pattern and micro-structure technology, which is applied in photosensitive material processing, photoplate-making process on patterned surface, photosensitive material used in photomechanical equipment, etc., can solve the problem of low reactivity, deformation of first resist pattern, formation Membrane reduction and other problems
CN1558290AInactive Publication Date: 2004-12-29RENESAS TECH CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
RENESAS TECH CORP
Publication Date
2004-12-29
Estimated Expiration
Not applicable · inactive patent

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Abstract

The fine pattern forming material comprises a water-soluble component which is cross-linkable by the presence of an acid, and water and / or a water-soluble organic solvent, wherein the water-soluble component is at least one selected from the group consisting of a water-soluble polymer, a water-soluble monomer, a water-soluble oligomer, a copolymer of a water-soluble monomer and salts of these. The fine pattern forming material is formed on a resist pattern 4 capable of supplying the acid and the water-soluble component causes a cross-linking reaction under the acid from the resist pattern 4 in parts in contact with the resist pattern 4 to form a water-or alkali-insoluble film 6.
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Description

technical field

[0001] The present invention relates to a fine pattern forming material and a method for forming a fine structure. Background technique

[0002] In recent years, along with the increase in the degree of integration of semiconductor devices, the size of each element has been miniaturized, and the width of wirings, gate electrodes, etc. constituting each element has also been miniaturized. Generally, after forming a desired resist pattern using photolithography, fine patterns are formed by etching various thin films of the substrate using the resist pattern as a mask. For this reason, photolithography is very important in forming fine patterns.

[0003] Photolithography consists of the processes of resist coating, mask alignment, exposure and development. However, in recent cutting-edge devices, the pattern size is approaching the limit resolution of photoexposure, so development of exposure technology with higher resolution is required.

[0004] As a conven...

Claims

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