Brownized treatment liquid for increasing adhesion of internal copper surface of circuit board and polymer material

A technology of polymeric materials and treatment fluids, which is applied in the secondary treatment of printed circuits and the improvement of the metal adhesion of insulating substrates. It can solve the problems of unresearched, high cost and expensive price, etc., and achieve high efficiency and corrosion inhibition effect. Good results

Inactive Publication Date: 2005-01-12
GUANGDONG TONESET SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, practice has proved that the main raw material 3-aminopropyl-trimethoxysilane used in this formula is relatively expensive, and the cost of using additives such as zinc sulfate, phenol, sodium sulfonate, and browning solution is relatively high.
[0003] For the formulations of the above two patents, some researchers have done some experiments, that is, retain most of the ingredients such as

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0028] Example one

[0029] Composition of browning liquid

[0030] H 2 SO 4 95 g / l

[0031] Water-soluble methoxylated polyethylene glycol 3.5 g / l

[0032] NaCl 25 mg / L

[0033] CuSO 4 ·5H 2 O 150 mg / L

[0034] 5-methyl-1-chlorobenzotriazole 8.0 g / L

[0035] H 2 O 2 (50%) 35ml / L

[0036] H 2 O increase to 1 liter

[0037] The treatment conditions were the same as those of the comparative example, and the following examples were all treated the same.

Example Embodiment

[0038] Example two

[0039] Composition of browning liquid

[0040] H 2 SO 4 90 g / l

[0041] Water-soluble methoxylated polyethylene glycol 4.0 g / l

[0042] NaCl 20 mg / L

[0043] CuSO 4 ·5H 2 O 100 mg / L

[0044] 1-Mercaptobenzotriazole 9.0g / L

[0045] H 2 O 2 (50%) 30ml / L

[0046] H 2 O increase to 1 liter

[0047] The treatment conditions are the same as in Example 1

Example Embodiment

[0048] Example three

[0049] Composition of browning liquid

[0050] H 2 SO 4 85 g / l

[0051] Water-soluble methoxylated polyethylene glycol 3.5 g / l

[0052] NaCl 15 mg / L

[0053] CuSO 4 ·5H 2 O 75 mg / L

[0054] 5-Methyl-1-hydroxybenzotriazole 8.5g / L

[0055] H 2 O 2 50% 35ml / L

[0056] H 2 O increase to 1 liter

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PUM

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Abstract

The multibond liquid consists of sulfur acid, hydrogen peroxide, halide ion, water-soluble poymer, inhibitor, triazole sulfone methanes, 1-substiteunt Benzotriazole, 4-substiteunt Benzotriazole or 5-monomethyl-substituent Benzotriazole.

Description

technical field [0001] The invention relates to a treatment solution for the copper surface of a circuit board, more specifically a treatment solution for improving the bonding force between the copper surface of the inner layer of the multilayer printed circuit of the printed circuit board and polymeric materials. Background technique [0002] In the treatment of the copper surface of the printed circuit board, the currently disclosed technology is a method for improving the adhesion between the polymeric material and the metal surface. This method is as described in U.S. Patent 6,503,566. The core of this method is a treatment solution. Invention, the formulation of which includes the oxidizing agent H 2 o 2 , sulfuric acid, corrosion inhibitor 1-hydroxybenzotriazole, aromatic nitro compounds, isopolyacids or heteropolyacids, water-soluble polymer methylated polyethylene glycol and halogen ion source. The corrosion inhibitor used in this invention is a benzotriazole with...

Claims

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Application Information

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IPC IPC(8): H05K3/38
Inventor 李宏钦王植材盖凤翔
Owner GUANGDONG TONESET SCI & TECH
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