Preparation method of silicon-based micro mechanical photomodulator chip

A light modulator and micro-machine technology, applied in the directions of micro-structure technology, micro-structure device, manufacturing micro-structure device, etc., can solve the problems of high production cost, complex preparation process, difficult application, etc., and achieve low cost and mature technology. , to achieve practical effect

Inactive Publication Date: 2005-03-16
EAST CHINA NORMAL UNIVERSITY
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Problems solved by technology

The Institute of Microtechnology of Neuchatel University in Sweden reported a micromechanical optical modulator with polysilicon as a suspended film in 1995, but the operating voltage of the modulator requires 90 volts, which is difficult to apply
The Department of Applied Phy

Method used

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  • Preparation method of silicon-based micro mechanical photomodulator chip
  • Preparation method of silicon-based micro mechanical photomodulator chip
  • Preparation method of silicon-based micro mechanical photomodulator chip

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[0056] In the above content of the invention, the technical scheme of the present invention has been described in detail. This scheme is a specific implementation of the present invention, and will not be repeated here. The invention is particularly suitable for preparing silicon-based micromechanical light modulator chips. Silicon-based micro-mechanical optical modulators have broad application prospects in the field of optical communications, especially in fiber-to-the-home systems, and are one of the main directions of contemporary micro-optical electromechanical systems (MOEMS) research. Micromechanical optical modulator is a key component in modern optical communication system, which can easily realize passive optical modulation in fiber-to-the-home system.

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Abstract

A preparation method of silicon-based micro mechanical photomodulator chip comprises: silicon piece preparation and phosphor diffusion; preparing sacrificial layer silicon dioxide film; preparing silicon nitride film; steaming aluminium film; negative photo-etching and corroding aluminium film; etching silicon dioxide film by reacting ion; removing aluminium film; corroding sacrificial layer silicon dioxide film; positive photo-etching; preparing compound metal film; finishing electrode preparation; negative photo-etching; corroding sacrificial layer silicon dioxide film to get suspending section; reacting ion striping. The inventive silicon-based micro mechanical photomodulator chip is a key element from the optical fiber to the communication system.

Description

[0001] The invention relates to a method for preparing a silicon-based micromechanical optical modulator chip, which belongs to the technical field of micromechanical device manufacturing. Background technique [0002] With the continuous development of information technology, especially the advancement of all-optical network technology, fiber-to-the-home (FTTH) will be gradually realized. Optical modulator is one of the key devices in the field of optical communication. After years of development, various types of optical modulation devices have appeared in optical communication systems. The modulation rate of these devices is very high, typically 10 per second 9 Bits, and expensive, are not suitable for individual users such as homes and offices. The amount of information these users need to upload is generally not large, and what they need is an optical modulator with low price and moderate speed (such as in the order of megabits per second). ...

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Application Information

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IPC IPC(8): B81C1/00
Inventor 茅惠兵王基庆赖宗声忻佩胜王力
Owner EAST CHINA NORMAL UNIVERSITY
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