Active evaporating radiation tech of power semiconductor device or modular

Abstract

In the invention, body case of power semiconductor device or module is fabricated to a hollow sealed shell body. Condenser is installed above the shell body. The said sealed shell body and condenser are connected to each other through pipe. Shell body of semiconductor device or module is as case of evaporator so as to form fully enclosed cooling circulation system. The disclosed cooling circulation system possesses very high cooling and heat radiation efficiency. Heat conductivity of the said system is more than 350 times of heat conductivity of good conductor (such as solid copper) with same geometrical size. Power semiconductor devices and modules with different power are available. The invention is suitable for cooling device with large power or devices in large installation density.

Description

technical field

[0001] The invention relates to a heat dissipation technology of a power semiconductor device or module, in particular to an active evaporation heat dissipation technology of a power semiconductor device or module. Background technique

[0002] Power semiconductor devices, from ordinary thyristors to new power electronic semiconductor devices such as GTO, GTR, MOSFET, IGBT, MCT, IGCT and IPM, as well as power semiconductor modules, all have large self-dissipation power Under the premise, it is possible to obtain a large output power. When a large current flows, the heating phenomenon is very serious. Only by dissipating the generated heat quickly, timely and effectively can the working stability and reliability of power semiconductor devices or modules be guaranteed. Therefore, the heat dissipation method of power electronic semiconductor devices or power semiconductor modules during operation is a restrictive condition for ensuring the stability and reliab...

Examples

Embodiment Construction

[0022] As shown in the drawings, the semiconductor wafer, chip or power integrated circuit 1a in the power semiconductor device or module 1 is integrated on the ceramic substrate 1b (the ceramic substrate does not need to be covered with copper), and then placed in a sealed or airtight casing 2 middle. This shell is the shell of the evaporator. The insulating evaporative cooling medium 3 is filled in the hollow casing, so that all the heat-generating parts are completely immersed in it. A condenser 4 is communicated with the upper part of the shell 2 through a pipeline. Thus, a fully enclosed cooling circulation system with positive pressure or negative pressure is formed, wherein the power wire or control wire harness 1c passes through the casing 2 in a sealed manner and connects with the external circuit. In the figure, the communication pipeline connecting the shell 2 and the condenser 4 is two pipelines including a steam pipe 5 and a return pipe 6 . When the power semic...

technical field

[0001] The invention relates to a heat dissipation technology of a power semiconductor device or module, in particular to an active evaporation heat dissipation technology of a power semiconductor device or module. Background technique

[0002] Power semiconductor devices, from ordinary thyristors to new power electronic semiconductor devices such as GTO, GTR, MOSFET, IGBT, MCT, IGCT and IPM, as well as power semiconductor modules, all have large self-dissipation power Under the premise, it is possible to obtain a large output power. When a large current flows, the heating phenomenon is very serious. Only by dissipating the generated heat quickly, timely and effectively can the working stability and reliability of power semiconductor devices or modules be guaranteed. Therefore, the heat dissipation method of power electronic semiconductor devices or power semiconductor modules during operation is a restrictive condition for ensuring the stability and reliab...

Examples

Embodiment Construction

[0022] As shown in the drawings, the semiconductor wafer, chip or power integrated circuit 1a in the power semiconductor device or module 1 is integrated on the ceramic substrate 1b (the ceramic substrate does not need to be covered with copper), and then placed in a sealed or airtight casing 2 middle. This shell is the shell of the evaporator. The insulating evaporative cooling medium 3 is filled in the hollow casing, so that all the heat-generating parts are completely immersed in it. A condenser 4 is communicated with the upper part of the shell 2 through a pipeline. Thus, a fully enclosed cooling circulation system with positive pressure or negative pressure is formed, wherein the power wire or control wire harness 1c passes through the casing 2 in a sealed manner and connects with the external circuit. In the figure, the communication pipeline connecting the shell 2 and the condenser 4 is two pipelines including a steam pipe 5 and a return pipe 6 . When the power semic...

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