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Rolled substrate for high temperature resistant smart card and method for making same

A calendering substrate and smart card technology, applied in the field of calendering substrates, can solve the problems of low resin softening point, poor processing performance, and inability to meet the processing performance of card base materials, and achieve the effect of overcoming fluorescence

Inactive Publication Date: 2005-04-06
上海达凯塑胶有限公司
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AI Technical Summary

Problems solved by technology

[0002] High-temperature-resistant smart cards (SIM cards) are widely used in telecommunications, transportation, finance and other industries. The conventional card base material is the very common polyvinyl chloride general-purpose plastic that people use in real life. Although it has high tensile strength, Compressive strength, hardness, high rigidity, good water resistance and many other advantages, but it also has low resin softening point, easy to produce toxic substances after decomposition, and its impact strength, elongation at break are small, processing performance is poor, etc. Disadvantages, unable to meet the requirements of card base material temperature resistance and processing performance in the molding process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] The following are percentages by weight.

[0055] Using a complete set of German five-roll calendering production line, 53.38% polyvinyl chloride resin, 27% a-methylstyrene-styrene-acrylonitrile copolymer, 5.30% a-methylstyrene-acrylonitrile copolymer, 4.52% titanium A mixture of white powder, 1.20% octyltin mercaptide, 1% acrylic acid copolymer, 4% calcium carbonate, 0.8% polymethyl methacrylate, 0.3% ethylene stearic acid bisamide and high-density chlorinated polyethylene , 0.4% calcium montanate, 0.9% phthalic acid distearate, 1.1% PVC composition ≥ 95% silicon-containing matte PVC resin and 0.1% Ultramarine 504 are respectively measured and blended into a high-speed kneader, When it reaches the rated temperature of 115°C, the program-controlled automatic cooling and stirring, fully kneaded at 50°C, enters the extrusion device through the mixing hopper, and is fed and calendered by the belt conveyor to the five-roll calender, and can be used to prepare PVC smart card...

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PUM

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Abstract

A calendering substrate used for tolerance high-temperature smart card and its preparation method.In this invention,the vicat heat-resistant of PVC resin formulation is improved by adding the ABS resin in the PVC resin and make its softening point reach 90 DEG C + / - 2(vical A50-5kg).Comprehensiving the flame retardant better-rigid low-price characteristics of PVC and the anti-impact high vicat-softening point easy-processing characteristics of ABS,the SIM card calendering substrate has good printing performation which is suitable for making heat-resistant special card such as mobile phone SIM card.In order to prepare the substrate,it just need to modify the formulation of PVC and ABS and adjust the temperature roller speed and speed ratio time of the production process,but do not need to change the production equipment and device transformation of the common smart card.

Description

technical field [0001] The invention relates to a calendering substrate for a high-temperature-resistant smart card (SIM card), in particular to a calendering substrate for a smart card with polyvinyl chloride (PVC) as the main material. Background technique [0002] High-temperature-resistant smart cards (SIM cards) are widely used in telecommunications, transportation, finance and other industries. The conventional card base material is the very common polyvinyl chloride general-purpose plastic that people use in real life. Although it has high tensile strength, Compressive strength, hardness, high rigidity, good water resistance and many other advantages, but it also has low resin softening point, easy to produce toxic substances after decomposition, and its impact strength, elongation at break are small, processing performance is poor, etc. The disadvantage is that it cannot meet the requirements of the temperature resistance of the card base material and the processing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C43/24C08K5/57C08L27/06
Inventor 钱铭义
Owner 上海达凯塑胶有限公司
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