Epoxy composition for light semiconductor packing

A technology of optical semiconductor and epoxy resin, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of poor heat resistance, reliability of optical semiconductor components, high moisture absorption rate, etc., and achieve high durability Ultraviolet light, excellent light transmittance, low moisture absorption effect

Active Publication Date: 2005-05-11
CHANG CHUN PLASTICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the alicyclic epoxy resin mentioned in the Japanese patent publication No. 03-94454 is adopted. Although the alicyclic epoxy resin can overcome the yellowing problem, its hardened product is brittle, easy to crack, and has high hygroscopicity. Under high humidity and other tests, it will cause reliability problems of optical semiconductor components
[0005] For this reason, the epoxy resin resistant to ultraviolet light also has hydrogenated bisphenol type epoxy

Method used

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  • Epoxy composition for light semiconductor packing
  • Epoxy composition for light semiconductor packing
  • Epoxy composition for light semiconductor packing

Examples

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Example Embodiment

[0071] Example

[0072] Each component used in embodiment and comparative example is described in detail as follows:

[0073] epoxy resin a: Bisphenol A type polyglycidyl ether produced by Changchun Artificial Resin Factory and sold under the trade name BE-501, its epoxy equivalent weight (EEW) is about 500g / eq.

[0074] epoxy resin b : Polyglycidyl ether of cresol-aldehyde condensate produced by Changchun Artificial Resin Factory and sold under the trade name CNE 200ELA, its epoxy equivalent weight is about 200 to 220g / eq, and the hydrolyzable chlorine is below 200ppm.

[0075] epoxy resin c : Triglycidyl ether of isocyanurate sold under the trade name TEPIC, produced by Nissan Chemical Institute, Japan, and its epoxy equivalent weight is about 100g / eq.

[0076] hardener : Hexahydrophthalic anhydride sold under the trade name HHPA, produced by Nippon RIKEN, with an acid content of about 154g / eq.

[0077] hardening accelerator : 2-methylimidazole.

[0078] Antiox...

Example Embodiment

[0079] Synthesis Example 1- Epoxy resin d (epoxy resin of formula (1) of the present invention)

[0080] In a stainless steel autoclave with electromagnetic stirring, 40 grams of epoxy resin b (CNE-200ELA, EEW=200, manufactured by Changchun Artificial Resin Factory Co., Ltd.), 120 grams of THF, and commercially available 5wt% Ru-C catalyst were placed 0.6 g, the reaction kettle was sealed, and hydrogen was introduced to make the pressure 5.0 MPa, the reaction temperature was controlled at 60°C, and the reaction time was 8 hours. After the reaction, the catalyst was filtered, and then the solvent was evaporated under vacuum at 150° C. to obtain the hydrogenated epoxy resin (epoxy resin d) of the aromatic ring of the structure of formula (1), the hydrogenation rate of the benzene nucleus was 84.8%, EEW=263 , loss rate of epoxy group = 24%.

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Abstract

The invention relates to an epikote that can encapsulate the element of the optical semiconductor. The epikote includes (A) epikote (B)hardener(C)hard accelerator. The invention has the high transmissivity and low hygroscopic degree. It could resist the UV radiation and its colour is not changed under the long heating. It is specially used for the elements of blue and white optical semiconductor.

Description

technical field [0001] The invention relates to an epoxy resin composition for optical semiconductor packaging, which has excellent high light transmittance, excellent high resistance to ultraviolet light, long-term heating without discoloration, and low moisture absorption, and is suitable for optical semiconductor components. packaged application. Background technique [0002] Epoxy resin has been widely used in electronic applications such as electrical insulation, electronic semiconductor packaging, and laminates due to its easy processability, high safety, and excellent mechanical and chemical properties. Among them, the characteristics of colorless, transparent and excellent electrical characteristics make many optical semiconductor components such as light-receiving elements and light-emitting elements for optical applications, such as light-emitting diodes, optocouplers, receivers, etc., use epoxy resin as a plastic package. Material. [0003] Generally, epoxy resi...

Claims

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Application Information

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IPC IPC(8): C08L63/00C09K3/10H01L23/28
Inventor 黄坤源杜安邦陈智富
Owner CHANG CHUN PLASTICS
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