Thermosetting polyimide matrix resin, preparation and use thereof

A technology of polyimide matrix and matrix resin, which is applied in the field of thermosetting polyimide matrix resin and its preparation, can solve the problems of low glass transition temperature of resin-based composite materials, achieve low porosity and excellent heat resistance , the effect of low viscosity

Inactive Publication Date: 2005-10-12
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In 1995, people such as R.D.Vannucci (Low Cost Non-MDA Polyimide for High Temperature Applications, SAMPE International Symposium, 40 (1), p277) reported a kind of polyimide base resin (AMB-21), and this base resin adopts 2 , 2-bis-4-phenoxy-4-phenylpropane (BAPP), has good molding processability; its disadvantage is that the glass transition temperature of the prepared resin-based composite material is low, which limits to a certain extent for its use in high temperature environments

Method used

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  • Thermosetting polyimide matrix resin, preparation and use thereof
  • Thermosetting polyimide matrix resin, preparation and use thereof
  • Thermosetting polyimide matrix resin, preparation and use thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0029] Embodiment 1: 64 parts of 3,3', 4,4'-benzophenone tetraacid dianhydride (BTDA) were heated and refluxed in 80 parts of ethanol for 1-3 hours to obtain the corresponding aromatic diacid diester solution ( BTDE). Heat 37 parts of the end-capping agent NA anhydride in 54 parts of ethanol to reflux for 1-5 hours to obtain the corresponding monoacid monoester solution (NE). Dissolve 79 parts of organic diamine monomer (TMMDA) in 50 parts of ethanol, stir for half an hour and then add the above-prepared NE and BTDE solutions in sequence; the mixture is stirred at 5-30°C for 2-15 hours to obtain solid A polyimide matrix resin solution with a content of 45%; its absolute viscosity (25° C.) is 25-40 mPa.s.

[0030] The resin solution is distilled under reduced pressure at 60-80° C. to remove most of the solvent to obtain a viscous liquid; it is heated and dried (50-220° C.) to obtain resin molding powder. Put 50g of molding powder into the mold, heat it in a press preheated to...

Embodiment 2

[0031] Embodiment 2: 146 parts of 3,3', 4,4'-benzophenone tetraacid dianhydride (BTDA) were heated to reflux in 200 parts of ethanol for 1-3 hours to obtain the corresponding aromatic diacid diester solution ( BTDE). Heat 33 parts of the end-capping agent NA acid anhydride in 50 parts of ethanol to reflux for 1-5 hours to obtain the corresponding monoacid monoester solution (NE). Dissolve 141 parts of diamine monomer TMMDA in 130 parts of ethanol, stir for half an hour, then add the previously prepared NE and BTDE solutions in sequence, and stir the mixture at 5-30°C for 2-15 hours to obtain a solid content of 41 % polyimide homogeneous resin solution. Its absolute viscosity (25°C) is 20-40mPa.s.

[0032] The resin solution is distilled under reduced pressure at 60-80° C. to remove most of the solvent to obtain a viscous liquid; it is heated and dried (50-220° C.) to obtain resin molding powder. Put 50g of molding powder into the mold, heat the mold in a press preheated to ...

Embodiment 3

[0033] Embodiment 3: 133 parts of 3,3', 4,4'-benzophenone tetraacid dianhydride (BTDA) were heated to reflux in 180 parts of ethanol for 1-3 hours to obtain the corresponding aromatic diacid diester solution ( BTDE). Heat 16 parts of end-capping agent NA acid anhydride in 50 parts of ethanol to reflux for 1-5 hours to obtain the corresponding monoacid monoester solution (NE). Dissolve 117 parts of diamine monomer TMMDA in 150 parts of ethanol, stir for half an hour, then add the previously prepared NE and BTDE solutions in sequence, and stir the mixture at 5-30°C for 2-15 hours to obtain a solid content of 37 % polyimide homogeneous resin solution. Its absolute viscosity (25°C) is 15-35mPa.s.

[0034] Composite the matrix resin solution with carbon fiber on a winding machine to prepare prepregs. After most of the solvents are volatilized, laminate them according to the requirements. Stages of prepreg (tape or cloth). Put the prepreg in stage B into a press preheated to 260...

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Abstract

The invention opened a process to make the polyimide resin plate which can resist the high temperature using the aromatic dianhydride, polyalkyl-diamine and capped agent as the material. The process is first to get the resin liquor from the above materials, then the liquor is moulded to the resin forming. The product can be used to make the resin moulding material and the resin compound material which can be used for the aviation, cosmonautics, precision machinery and petrochemical engineering.

Description

technical field [0001] The invention discloses a thermosetting polyimide matrix resin, a preparation method and application thereof. Background technique [0002] In 1972, T.T.Serafini et al. (ThermallyStable Poiyimide from Solutions of Monomeric Reactants, J.Appl.Polym.Sci., 1972, 16:905; U.S.Patent 3,745,149) of the US NASA Lewis Research Center reported the use of monomeric reactants in situ The matrix resin (PMR-15) of high temperature resistant (316°C) carbon fiber reinforced polyimide resin-based composite material prepared by polymerization (Insitu Polymerization of Monomer Reactants) method. At the same time, the Institute of Chemistry, Chinese Academy of Sciences has also successfully developed a method for preparing PMR-type polyimide matrix resin (KH-304). Different from PMR-15, KH-304 matrix resin uses non-toxic and harmless low-boiling anhydrous ethanol instead of anhydrous methanol as the main solvent in the resin preparation process, which can not only reduce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10
Inventor 杨士勇陈建升范琳
Owner INST OF CHEM CHINESE ACAD OF SCI
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