Laser milling method for hard brittle material

A hard and brittle material, laser milling technology, used in laser welding equipment, welding equipment, metal processing equipment and other directions, can solve the problems of high melting point hard and brittle materials without relevant reports, and achieve easy promotion, simple method and structure. simple effect

Inactive Publication Date: 2006-02-08
ANHUI UNIVERSITY OF ARCHITECTURE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, so far, there has been no relevant report on the technology of using solid-state...

Method used

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  • Laser milling method for hard brittle material
  • Laser milling method for hard brittle material
  • Laser milling method for hard brittle material

Examples

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Embodiment 1

[0023] Solid-state pulsed laser machining of cemented carbide molds.

[0024] Cemented carbide is widely used as a tool and mold material in industry. It is sintered at high temperature with hard phase WC with a particle size of 0.8-3 μm and Co with a particle size of 0.7-1.1 μm as the binder phase. The hardness is extremely high, and the hardness at room temperature reaches HRA89-93, which is difficult to process by conventional machining methods.

[0025] In this embodiment, first draw on the computer figure 2 The milling contour figure 3 shown, and then draw the section line, note that the section line spacing is set to 0.2mm, the section line is a set of horizontal lines, fix the cemented carbide 2 on the worktable, and select the worktable moving speed as 2mm / s, the parameters of laser rough milling are set to repetition frequency 50Hz, laser pulse width 0.5ms, considering the melting point and thermal conductivity of cemented carbide are relatively high, the laser ene...

Embodiment 2

[0027] see image 3 , to the widely used Al 2 o 3 The processing of engineering ceramics 4 is taken as an example. Ceramics are substances combined by covalent bonds, ionic bonds or a mixture of the two. At room temperature, they have great resistance to shear stress deformation and high hardness. Because the ceramic crystal ions are combined by chemical bonds, the ceramics show great brittleness. It is precisely because of these characteristics of ceramics that ceramics are typical difficult-to-machine materials for conventional processing methods. In particular, it is very difficult to process components with high precision and complex shapes. The increase in the cost of finishing has seriously hindered the popularization and application of fine ceramics, so the subsequent processing of fine ceramics often becomes the key to its engineering application.

[0028] In this example, for Al 2 o 3 The milling process of engineering ceramics 4 is also to first draw the millin...

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Abstract

The laser milling method for hard fragile material uses solid pulse laser for manufacture. Compared with common methods, this invention needs not to prepare electrode and mould, easy to manufacture for single piece and small scale; the laser device has simple structure and well reliable to spread in industry, which has high power density and fit to material of high melting point, such as high alloy steel, semiconductor silicon slice, engineering ceramics, and diamond.

Description

Technical field: [0001] The invention relates to a processing method, more specifically a method for milling various hard and brittle materials. Background technique: [0002] Hard and brittle materials such as cemented carbide, high-alloy steel, hardened steel, semiconductor silicon wafer, engineering ceramics and diamond are widely used in the fields of machinery, precision optical devices, electronics and electrical appliances, and usually require blind holes, slots and Special-shaped groove processing, but these materials are difficult to be processed by conventional mechanical methods. EDM can be used for processing conductive materials, but EDM needs to make electrodes, and there are problems such as low efficiency and electrode loss. Non-conductive materials have blind holes, Grooves and special-shaped grooves can be processed by modern methods such as ultrasonic waves, but there are also problems such as low efficiency. [0003] With the development of laser technol...

Claims

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Application Information

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IPC IPC(8): B23K26/38B23K26/40
Inventor 袁根福梁华琪
Owner ANHUI UNIVERSITY OF ARCHITECTURE
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