Copper or copper alloy surface tiny-etching treatment fluid for smoothing

A technology of micro-etching treatment and copper alloy, which is applied in the field of metal surface treatment liquid, can solve problems such as difficult analysis and control, affecting chemical plating, and high organic content

Inactive Publication Date: 2006-02-08
广东省石油化工研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the composition of the solution is difficult to analyze and control in continuous production, and the content of organic matter is high, making it difficult to treat wastewater
U.S. Patent No. 5,630,950 discloses an acidic polishing solution containing sulfuric acid, hydrogen peroxide and a stabilizer. The concentration of hydrogen peroxide in the treatment solution is too high, and bumping is prone to occur. At the same time, a layer of organic polymer will be deposited, which will affect the subsequent electroless plating

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] See Table 1 for Examples 1-4 and Comparative Examples 1-2. Prepare the micro-etching treatment solution according to the ingredients shown in Table 1, immerse it in a 1.0 OZ double-sided copper-clad board at a temperature of 25°C for 60 seconds, then take it out, and dry it with hot air. Gloss was used to evaluate the smoothness of the treated copper surface. The gloss was obtained by measuring the 20-degree specular gloss according to JIS Z 8741 using a portable gloss meter ZGM 1120 from ZEHNTNER, Switzerland. The results are shown in Table 1.

[0018] As shown in Table 1, the copper or copper alloy surface micro-etching treatment solution of the present invention can treat its surface into a smooth surface with a glossiness greater than 80 at a low concentration of hydrogen peroxide, and the composition analysis and control are simple, and it is not prone to bumping. Pretreatment of various electroless plating of printed circuit boards.

[0019] Example

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PUM

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Abstract

The invention relates to a metal surface processing liquid for printed circuit board, wherein the components of the process liquid include (by weight ratio): 35% hydrogen dioxide solution 3-12, 98% sulfuric acid 5-20, unsaturated alkane glycol compound 0.1-5, stabilizing agent 0.1-0.5, fluorine surface active agent 0.001-0.02, and balancing deionized water diluent.

Description

technical field [0001] The invention relates to a metal surface treatment liquid, in particular to a metal surface treatment liquid for printed circuit boards. Background technique [0002] With the global lead-free process, the final solderability coating process of printed circuit boards has shifted from hot air leveling to electroless nickel gold plating, electroless tin plating and electroless silver plating. To improve the planarity and brightness of electroless plating, smooth copper microsurfaces are required. In Chinese Patent Publication No. 1389596, the aqueous solution containing hydroxylamine, oxidizing agent, ammonium salt and azole compound is described in detail as a smooth copper surface treatment solution. However, the composition of the solution is difficult to analyze and control in continuous production, and the content of organic matter is high, making wastewater treatment difficult. U.S. Patent No. 5,630,950 discloses an acidic polishing solution cont...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/34
Inventor 蔡汉华李伟浩高敏陆云欧志强
Owner 广东省石油化工研究院
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