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Epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained thereof

A technology of epoxy resin and epoxy compound, applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of lack of catalytic ability, inability to carry out, and lack of promotion effect

Inactive Publication Date: 2006-06-07
MITSUI CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the catalytic activity of bases such as tertiary amines, quaternary ammonium salts, and phosphonium salts is not sufficient
[0009] Therefore, there is a problem that in any case, in order to fully complete the reaction, it is necessary to increase the amount and concentration of these catalysts, or to carry out the reaction under severe conditions, thereby causing side reactions; or generating raw materials, products, etc. Decomposition and other issues
Therefore, the inventor speculates that in the commonly used curing accelerators, no effective curing reaction can be carried out, and the resulting cured product is formed by the curing reaction of some residual phenolic hydroxyl groups or by the self-polymerization of the epoxy resin.
[0035] That is, the curing accelerator currently used in the curing reaction of epoxy resin and phenolic resin does not have effective catalytic ability in the curing reaction of epoxy resin and resin containing ester group
[0036] In addition, it has been found out by the present inventors that typical curing accelerators currently used for epoxy-phenolic curing, such as phosphine compounds such as triphenylphosphine, imidazole compounds such as 2-methylimidazole, etc. - No effective acceleration in ester addition reaction (Japanese Patent Application Laid-Open No. 2000-327751, etc.)

Method used

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  • Epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained thereof
  • Epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained thereof
  • Epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 101

[0238] With 0.442g (1.00mmol) three (2,6-dimethoxyphenyl) phosphine (hereinafter referred to as "2,6-DMPP") and 14.3g (105mmol) phenyl acetate (in formula (2) R 1 is methyl, OZ 1 Carboxylate of an organic group formed by phenol) was put into a 100ml flask, and after heating up to 90°C, 15.0g (100mol) of phenyl glycidyl ether (referred to as "PGE" for short) was added dropwise therein for 10 minutes. ). After completion of the dropwise addition, the mixture was stirred at this temperature for 5 hours, and then returned to room temperature over about 10 minutes. Part of the reaction solution was taken, and 1,3,5-trichlorobenzene was used as an internal standard, and quantitative analysis was carried out by gas chromatography. The raw material PGE was almost completely consumed, and the target acetic acid 1,3-diphenoxy-2-propane The yield of the ester was 95% (based on PGE), and the reaction proceeded almost quantitatively. The reaction solution was directly added to the chro...

Embodiment 102

[0240] Except using equimolar tris(2,4,6-trimethoxyphenyl) phosphine (abbreviated as "TMPP") instead of 2,6-DMPP in Example 101, the others were completely reacted as in Example 101 . As in Example 101, the raw material PGE was almost completely consumed, and the production yield of 1,3-diphenoxy-2-propyl acetate was 97%, and the isolated yield was 91%. The catalytic activity is very high, reaching 20mol / mol·h.

Embodiment 103

[0260] In addition to using equimolar tris (2,4-dimethoxyphenyl) phosphine instead of 2,6-DMPP in Example 101, the other reactions were exactly the same as in Example 101, and the target acetic acid 1,3-di The yield of phenoxy-2-propyl ester was as high as 95%, and the isolated yield was 89%.

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Abstract

The present invention relates to an epoxy resin composition using a specific triarylphosphine-substituted compound as a curing accelerator, a cured product of the epoxy resin composition, and a semiconductor device formed using the epoxy resin composition.

Description

[0001] This case is filed on July 11, 2003 , the application number is 03801525.0 , the name of the invention is Method for producing organic compound, epoxy resin composition, cured product of the epoxy resin, and use The semiconductor device formed of the epoxy resin divisional application technical field [0002] The present invention relates to a method for producing an organic compound using a triarylphosphine-substituted compound as a catalyst (the first invention), an epoxy resin composition using a triarylphosphine-substituted compound as a curing accelerator, and a cured product of the composition, as well as using the A semiconductor device formed from the composition (second invention). [0003] That is, the first invention is an effective method for producing an organic compound by reacting a raw material organic compound in the presence of a phosphine compound represented by formula (1). [0004] [0005] In the formula, X 1 ~X 9 and Y 1 ~Y 6 Each ind...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/40C08G59/42C08G59/62C08G59/68H01L23/29
CPCC08G59/40C08G59/42C08G59/688H01L23/293H01L2924/0002H01L2924/12044H01L2924/00C08G59/00H01L23/29
Inventor 吉村成利昇忠仁山本喜博林贵臣清野真二浦上达宣川畑朋之前田直
Owner MITSUI CHEM INC