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Epoxy resin composition

A technology of epoxy resin and composition, applied in the direction of epoxy resin coating, plastic/resin/wax insulator, coating, etc., can solve the problems of limited use, environmental impact of halogen-based solvents, and impact of prepreg sheet manufacturing. , to achieve the effect of excellent heat resistance and excellent dielectric properties

Active Publication Date: 2006-06-28
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, halogen-based solvents may have an impact on the environment, and their use tends to be restricted
On the other hand, it has been pointed out that when toluene is used as an aromatic solvent, polyphenylene ether gels, or in order to prevent gelation, it is necessary to keep the varnish at a high temperature and impregnate it into the base material, etc. Manufacture of impregnated sheets brings impact

Method used

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  • Epoxy resin composition
  • Epoxy resin composition
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Examples

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Effect test

manufacture example 2

[0149] Polyphenylene ether II was obtained in the same manner as in Production Example 1 of polyphenylene ether except that the post-washing step with methanol was not performed.

[0150] As a result of molecular weight measurement by gel permeation chromatography of polyphenylene ether II, the number average molecular weight was 2,000, and there was no component with a molecular weight of 20,000 or more, but there was a component with a molecular weight of 300 or less. In addition, the number of phenolic hydroxyl groups per molecule was 1.7.

manufacture example 3

[0152] Using a known method for producing polyphenylene ether, for example, the method described in the examples of US Pat. No. 6,211,327, the reaction is stopped at the initial stage of the reaction and washed with methanol. That is, using copper bromide and di-n-butylamine as a catalyst, in a toluene solvent at a temperature range of 40°C to 45°C, while stirring under oxygen supply, 2,6-dimethylphenol was added, Allow it to react for only 30 minutes, although usually 100 minutes. Next, the supply of oxygen was stopped, and an aqueous solution of nitrilotriacetic acid was added while stirring under a nitrogen seal, and the copper catalyst was extracted in the water phase, and the temperature was maintained at 55° C. for 70 minutes. Then, the copper catalyst was removed by centrifugation and washed with methanol solution. As a result, polyphenylene ether III having a number average molecular weight of 2,000 and containing no components having a molecular weight of 20,000 or m...

manufacture example 4

[0154] Polyphenylene ether IV was obtained in the same manner as in Production Example 1 of polyphenylene ether except that the step of adding additional benzoyl peroxide was not performed.

[0155] As a result of measuring the molecular weight of polyphenylene ether IV by gel permeation chromatography, the number average molecular weight was 2,300, and there was no component with a molecular weight of 300 or less, but there was a component with a molecular weight of 20,000 or more. In addition, the number of phenolic hydroxyl groups per molecule was 1.6.

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Abstract

The present invention relates to an epoxy resin composition, which contains polyphenylene ether and epoxy resin, the polyphenylene ether has a number-average molecular weight of 1000-4000, and substantially 20% or more of components with a molecular weight of 20000 or more the following. Furthermore, the present invention also relates to an epoxidized polyphenylene ether resin obtained by reacting phenolic hydroxyl groups of polyphenylene ethers having a number average molecular weight of 1000 to 4000 with epoxy compounds or epoxy groups of epoxy resins. .

Description

technical field [0001] The present invention relates to an epoxy resin composition containing polyphenylene ether useful as an insulating material such as printed wiring boards, an epoxy resin composition solution, a varnish using an organic solvent for the epoxy resin composition, and impregnating the varnish A prepreg formed in a base material, a laminate using the prepreg, a curable resin-metal foil composite containing a polyphenylene ether-containing epoxy resin composition and a metal foil, a curable resin-metal foil composite containing an epoxy resin Thin films of non-toxic compositions and printed wiring boards and electronic devices using these substances. Background technique [0002] Epoxy resins excellent in cost efficiency are widely used as insulating materials for printed wiring boards. However, in recent years, in order to cope with higher density of wiring, etc., further higher performance has been sought. As one of them, printed wiring boards used in high...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/22C08G59/32C08G65/48C08L71/12H01B3/40H05K1/03
CPCC08G59/226C08G59/3218C08G65/48C08L63/00C08L71/12C08L71/126C09D163/00H01B3/40H05K1/0326C08L2666/22
Inventor 内田浩司鬼塚贤三高田义彦常盘哲司
Owner ASAHI KASEI KK
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