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Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film

An adhesive, adhesive film technology, applied in the direction of film/sheet adhesive, adhesive type, semiconductor devices, etc., can solve the problem of cracks, unusable, thermal expansion coefficient of semiconductor chips and printed wiring boards big difference

Inactive Publication Date: 2006-09-27
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] In the case of mounting a semiconductor chip on a printed wiring board using these adhesives, which are printed wiring board related materials, the difference in thermal expansion coefficient between the semiconductor chip and the printed wiring board is large, and cracks will be generated during reflow , so you cannot use
In addition, it cannot be used because of the large deterioration in the humidity resistance test under severe conditions such as a temperature cycle test or PCT treatment.

Method used

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  • Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film
  • Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film
  • Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film

Examples

Experimental program
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Effect test

Embodiment 1

[0144] figure 1 (a) is a cross-sectional view of a single-layer thermosetting adhesive film, which is composed of a thermosetting adhesive 1 and its cured product is determined by a dynamic viscoelasticity measuring device at 25° C. The elastic modulus 10 is defined as the range of 2000 MPa, and , The modulus of elasticity at 260° C. is specified in the range of 3-50 MPa, and the semi-cured state is at the level of 10-40% of the total curing heat generation when measured by DSC (differential calorimeter). An epoxy group-containing acrylic copolymer film in which the amount of solvent remaining in the thermosetting adhesive film is dried to 2% or less is used.

[0145] figure 1 (b) shows a cross-sectional view of a three-layer adhesive film in which a thermosetting adhesive 1 is applied to both sides of a polyimide film 2 . In this example, U-pilex (trade name) with a thickness of 50 micrometers manufactured by Ube Industries was used as the polyimide film.

[0146] figure...

Embodiment 2

[0157] Figure 7 The manufacturing steps of the semiconductor mounting substrate and the semiconductor device are shown.

[0158] The thermosetting adhesive tape (adhesive member) 3 made of thermosetting adhesive 1 is cut into a prescribed size ( Figure 7 (a)). The cured product of thermosetting adhesive 1 has an elastic modulus of 10-2000 MPa at 25°C measured with a dynamic viscoelasticity measuring device, and an elastic modulus of 3-50 MPa at 260°C. The semi-cured state is about 10 to 40% of the total curing heat generation.

[0159] On the surface of the polyimide wax substrate 5 where one layer of Cu wiring is applied and the inner lead portion and the through hole for the external solder terminal are formed as in the TAB tape, the cut thermosetting adhesive tape 3 is precisely aligned. Afterwards, carry out hot pressing with hot press machine, obtain the substrate for semiconductor mounting ( Figure 7 (b)).

[0160] In this example, a multi-connected semiconductor...

Embodiment 3

[0180] As the epoxy resin, 45 parts by weight of bisphenol A type epoxy resin (epoxy equivalent 200, produced by Yuhua Shell Epoxy Co., Ltd.) 45 parts by weight; cresol novolak type epoxy resin (epoxy equivalent 220 , ESCN001) 15 weight parts that Sumitomo Chemical Industry Co., Ltd. produces; As epoxy resin solidifying agent, use novolak type epoxy resin (プリイオ-fen LF2882 that Dainippon Ink Chemical Industry Co., Ltd. produces) 40 weight parts; Have miscibility with epoxy resin and the high molecular weight resin of weight-average molecular weight more than 30,000 is used, phenoxy resin (molecular weight 50,000, the フェノト-トYP-50 that Dongdu Chemical Co., Ltd. produces) 15 parts by weight; As Epoxy-containing acrylic rubber, use 150 parts by weight of epoxy-containing acrylic rubber (molecular weight 1,000,000, HTR-860-P3 produced by Imperial Chemical Industry Co., Ltd.); as curing accelerator, use curing accelerator 1-cyanoethyl -2-phenylimidazole (キュゾ-ル 2PZ-CN) 0.5 parts by we...

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Abstract

The invention aims at improving the temperature resisting cycle characteristics after mounting and moisture absorption resiting reflow characteristics of a chip-mounted semiconductor, and provides an adhesive which functions as a bonding member to be used when a semiconductor chip is mounted on an organic supporting substrate and which has storage moduli at 25 DEG C and at 260 DEG C as measured with a dynamic visco-elasticity measuring instrument of 10-2000 MPa and 3-50 MPa, respectively, a double-coated adhesive film produced therewith, a semiconductor device, an semiconductor chip mounting substrate, and methods of manufacturing these products.

Description

[0001] This application is an application with the application number "97199604.0", the filing date is October 8, 1997, and the title of the invention is "semiconductor device, semiconductor chip mounting substrate, their manufacturing method, adhesive and double-sided adhesive film" division case. technical field [0002] The present invention relates to a semiconductor device, a manufacturing method thereof, a substrate for mounting a semiconductor chip suitable for use in the manufacture of the semiconductor device, a manufacturing method thereof, an adhesive, and a double-sided adhesive film. Background technique [0003] In recent years, with the miniaturization of electronic equipment and the high frequency of work, the semiconductor packages that load them are required to be mounted on the substrate at high density. With the progress of miniaturization and light weight, people have developed an array of external terminal areas. Small packages called micro BGA (Ball Gr...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J7/00H01L23/12
CPCH01L24/29H01L2224/32225H01L24/50H01L24/45H01L24/83H01L2924/15311H01L2224/48227H01L2224/73265H01L2224/83192H01L2924/01029H01L2224/92247H01L2224/83101H01L2224/45124H01L2924/01012H01L24/73H01L2224/2612H01L2224/45H01L2224/45144H01L2224/50H01L2924/15183H01L2924/181H01L2924/351H01L2924/00H01L2924/00012H01L2924/00014H01L2924/3512H01L23/12
Inventor 山本和德岛田靖神代恭稻田祯一栗谷弘之金田爱三富山健男野村好弘细川羊一桐原博景山晃
Owner HITACHI CHEM CO LTD
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