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Plating method

A copper plating bath, printed circuit board technology, applied in the direction of printed circuits, electrical components, printed circuits, etc., can solve the problems of inability to effectively fill through holes and/or blind holes, and inability to effectively provide flat copper deposition

Active Publication Date: 2011-03-09
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Current plating bath additives, especially current leveling agents are not effective in providing planar copper deposits on the substrate surface, nor are they effective in filling vias and / or blind vias

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Imidazole (225 g) was dissolved in water (563 mL) in the reactor. The mixture was heated to 80°C with stirring. With continued stirring, 607.5 ml of a 60.8% aqueous solution of 1,4-butanediol diglycidyl ether ("BDE"), wherein BDE has the formula Diepoxide functional compounds. After the addition of BDE, the temperature of the mixture was maintained at 95±3°C for 5.5-6 hours with stirring. After heating, the mixture was stirred for 16-18 hours. The pH of the reaction product mixture is then adjusted to 6-7 with sulfuric acid. The reaction product was then transferred to a suitable container and diluted with DI water as needed. The polydispersity of the reaction product is less than 2.5 and the Mw is about 14000.

Embodiment 2

[0054] Repeat the procedure of Example 1, except that the leveling agent used is a 1:0.6 reaction product of imidazole and BDE, the Mn of the reaction product is 2700-2900, the Mw is 4500-4700, and the polydispersity is 1.6-1.7.

Embodiment 3

[0056] A copper plating bath was prepared by mixing 40 g / L copper in the form of copper sulfate, 10 g / L sulfuric acid, 50 ppm chloride ions, 10 mL / L accelerator and 3 mL / L suppressor. Accelerators are disulfides containing sulfonic acid groups with a molecular weight of less than 1000. The inhibitor is EO / PO copolymer with a molecular weight of less than 5000 and contains terminal hydroxyl groups. The plating bath also contained 1 mL / L of the reaction product from Example 1.

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Abstract

Copper plating baths containing a leveling agent that is a reaction product of a compound including a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a polyepoxide compound containing an ether linkage that deposit copper on the surface of an electronic device and in apertures on such substrate are provided. Such plating baths deposit a copper layer on the substrate surface that is substantially planar across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.

Description

technical field [0001] The present invention relates generally to the field of electrolytic plating. In particular, the invention relates to the field of electrolytic plating of copper. Background technique [0002] Methods of electroplating metal coatings on articles generally involve passing an electrical current between two electrodes in an electroplating bath, one of which is the article to be plated. A typical acid copper plating bath contains dissolved copper, an acid electrolyte and suitable additives. Among them, the dissolved copper is usually copper sulfate; the acid electrolyte is, for example, sulfuric acid, in an amount sufficient to provide conductivity to the electrolytic bath; additives are used to improve the uniformity of plating and the quality of metal deposition. The additives include accelerators, leveling agents, surfactants, inhibitors and the like. [0003] Electrolytic copper plating baths have many industrial uses. They are used, for example, i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38
CPCH05K3/423C25D3/38H05K2201/09563H05K2201/09509
Inventor 林慎二朗土田秀树日下大蓬田浩一
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC