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Forming method for anti-corrosion layer

A technology of anti-corrosion layer and ceramic material, which is applied in the field of temperature-sensing rods, can solve problems such as cracking, high operating temperature, and perforation, and achieve the effect of long service life

Inactive Publication Date: 2007-03-07
TANGTECK EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As for lead-free solder, due to its higher tin content, and the operating temperature is about 50°C higher than that of traditional tin-lead alloys, the molten tin is easy to attack and dissolve the chromium oxide protective layer on the surface of stainless steel, so that the tin bath metal gradually dissolves. Into the molten solder, and finally cause the corrosion of the tin bath, even perforation, rupture

Method used

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  • Forming method for anti-corrosion layer
  • Forming method for anti-corrosion layer
  • Forming method for anti-corrosion layer

Examples

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no. 1 example

[0042] Please refer to FIG. 2, which is a method for forming the anti-corrosion layer on an existing object. The forming method of the anti-corrosion layer includes first providing an object, and the object has a metal surface (S201); secondly, attaching a ceramic material to the metal surface of the object (S203), wherein the ceramic material has oxide or nitrogen compound or carbide or boride, or a mixture of the oxide, nitride, carbide and boride, etc.; finally, a bond is produced between the ceramic material and the metal surface of the object (S205), so that the A corrosion-resistant layer made of ceramic material is formed on the metal surface of the object.

[0043] Among them, the bonding method between the ceramic material and the metal surface is to first dry the adhered ceramic material, and then heat-treat the object and the ceramic material on the object and fire, so that the ceramic material can be firmly attached. It is difficult to peel off on the metal surfac...

no. 2 example

[0047] Please refer to Fig. 3, which further includes the manufacturing and processing of the predetermined object. The forming method of the anti-corrosion layer includes first providing a stainless steel plate (S301), the stainless steel plate can be such as SUS301, SUS304 and SUS316 etc. Ostian series stainless steel plate; then utilize the stainless steel plate to process into a predetermined object (S303), The predetermined object can be a tin bath, the peripheral object of the tin bath or a temperature-sensing rod, and its processing equipment can be a punch press, a welding machine, etc.; The attachment of the predetermined object, and its cleaning equipment can be a cleaning tank, etc.; then carry out surface treatment on all or a predetermined part of the predetermined object (S307), the so-called predetermined part of the predetermined object means that the predetermined object will be in contact with lead-free solder As for any part of the surface treatment method, ...

no. 3 example

[0049] Please refer to FIG. 4 , which shows that the anti-corrosion layers 4 , 4 a are formed on a tin bath 2 with a plurality of heating pipes 23 . The method for forming the anti-corrosion layer includes: first providing a tin bath 2, the tin bath 2 has a plurality of metal inner walls 21, and a plurality of hollow metal outer tubes 22 are bridged between one of the opposite inner walls 21, and each of the A heating tube 23 is inserted in the hollow inside of the outer tube 22; a ceramic material (Fig. not shown in); then the ceramic material is attached to the inner wall 21 of the tin bath 2 and the outer tube wall of the outer tube 22; finally the ceramic material is bonded with the inner wall 21 of the tin bath 2 to Form the anti-corrosion layer 4 as shown in the figure, and form the anti-corrosion layer 4a as shown in the figure by bonding between the outer tube wall of the outer tube 22, so that the inner wall 21 of the tin bath 2 can Corrosion-resistant layers 4 and 4...

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Abstract

The invention discloses a corrosion resistance layer forming method to prevent lead-free tin solder corrosively, which comprises the following steps: providing an object (tin groove, external object of tin groove or temperature-sensing bar) with metal surface; supplying a ceramic material with oxide, nitride, carbide, boride or compound of oxide, nitride, carbide and boride; adhering ceramic material on the metal surface of object; generating bond connection between ceramic material and object.

Description

technical field [0001] The invention relates to a method for forming an anti-corrosion layer, especially a method for forming an anti-corrosion layer developed for the high corrosiveness of lead-free solder, so as to be applied to tin baths, peripheral objects of tin baths, or temperature sensing rods . Background technique [0002] The traditional tin-lead alloy solder has good mechanical properties, soldering compatibility, wettability and bonding characteristics, and is low in cost. It can also be made into many solders with different high, medium and low melting points due to the adjustment of the composition. Therefore, It has been widely used for a long time, such as the relatively well-known electronic assembly bonding materials. [0003] However, because the lead contained in solder is extremely harmful to human health, countries around the world are actively revising relevant laws and regulations to prohibit the use of lead-containing materials. Therefore, various ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23D5/02C04B35/01
Inventor 蒋焕梧许志雄陈阿赐周兆民游明辉
Owner TANGTECK EQUIP
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