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Anisotropic conductive sheet

An anisotropic, conductive plate technology, applied in the direction of conductive connections, conductors, circuits, etc., to achieve excellent durability, high heat resistance, and the effect of solving fault continuity

Inactive Publication Date: 2007-03-28
SUMITOMO ELECTRIC IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the inspection must be done without causing short circuits between the electrodes of the inspection device or between the electrodes of the chip and other electrodes

Method used

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example

[0046] Preparation of Electrically Insulating Multiwell Plates

[0047] One hundred parts by weight of polyvinylidene fluoride-hexafluoropropylene copolymer (DAL-ELG-701, manufactured by DAIKIN Industries, Ltd.), 2 parts by weight of azodicarboxylic acid amide (ADCA) based Foaming agent (CELLMIC CAP250, manufactured by Sankyo-k. Co., Ltd.), 20 parts by weight of clay (Burgess #30, manufactured by Shiraishi Calcium Co., Ltd.) used as a foaming nucleating agent, 1.5 parts by weight 2 parts by weight of high-purity magnesium oxide (Kyowa MagMA-150, manufactured by Kyowa Chemical Industry Co. Ltd.), and 2 parts by weight of commercially available calcium hydroxide were mixed, kneaded, and thereafter formed into a preform of 1 mm thickness plate. The preformed board was placed in a board forming mold having a depth of 2 mm, and heated at 165° C. for 20 minutes, thereby obtaining a board-like foam member. The foam board has an average cell size of 50 μm, and a porosity of 40%. ...

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Abstract

An anisotropic conductive sheet which does not damage a wafer nor the electrode terminals of a conduction measuring instrument due to loading when the wafer is to be inspected, and ensures a good conductivity. The anisotropic conductive sheet (1) comprises porous resin layers formed by foaming and electron-beam-crosslinking fluororubber or tetrafluoroethylene-propylene copolymer rubber having an open cell structure and provided on the inner walls of a plurality of through holes (3) pierced in the thickness direction of an electrically-insulating porous sheet (2) made of foamed fluororubber or the like, characterized in that the skeleton surface of the porous resin is coated with metal. In addition, it is especially preferable for porous resin.

Description

technical field [0001] The present invention relates to an anisotropic conductive plate such as inspection of semiconductor wafers and the like. Background technique [0002] Anisotropic conductive plates have been used in inspection devices to determine whether, in the wafer state, semiconductor chips are formed according to specifications. In this inspection apparatus, electrodes for conduction with circuits on the wafer are formed for each of a plurality of chips formed on the wafer. Therefore, electrodes are formed at a very high density. However, the inspection must be done without causing short circuits between the electrodes of the inspection device or between the electrodes of the chip and other electrodes. When the anisotropic conductive plate is sandwiched between the inspection device and the wafer, inspection can be done without causing short circuits between the electrode of interest and other electrodes. [0003] Since the anisotropic conductive plate is not...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R11/01H01B5/16H01R13/24
CPCH01R12/7076H01L23/00H01L24/00H01L2924/01012H01R13/2414H01R9/098H01R23/6806Y10T428/24322H01B5/16H01R11/01
Inventor 奥田泰弘藤田太郎
Owner SUMITOMO ELECTRIC IND LTD