Method for preparing Al-Si-Cu-based alloy metallographic sample and displaying tissue thereof

A technology of aluminum-silicon-copper and samples, which is applied in the field of preparing aluminum-silicon-copper alloy metallographic samples and displaying structures, can solve problems such as inability to distinguish grain boundaries, surface flow, and hinder microscopic analysis of samples, and achieve low labor intensity and high production efficiency high effect

Inactive Publication Date: 2007-05-23
KONFOONG MATERIALS INTERNATIONAL CO LTD
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AI-Extracted Technical Summary

Problems solved by technology

[0002] Due to the low hardness of 99.999% high-purity aluminum, pure aluminum and some aluminum alloys are very soft. When preparing metallographic samples, it is easy to scratch the surface during grinding and polishing, and it is difficult to obtain a very bright metallographic sample. samples, and the high-purity aluminum grain boundary display is more difficult than the ordinary aluminum grain boundary display
After corroding a sample with a dull surface, it will be di...
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Abstract

Preparation of Al-Si-Cu alloy metallography sample and display organize method, it includes the following steps: a. rough grinding: using size reduction water sandpapers in turn, the samples are accomplished at least two times water polished, and after each sandpaper changing rotate 90 degree, until eliminating the scratch of the previous process, and before sandpaper changing, the samples are cleaned with water; b. electrolytic polishing: using the electrolytic polishing machine, polish at least two times, and after each time, rinse and cool with water; c. flannel polishing: samples polish on the single direction with the polishing pasted silk cloth; d. chemical etching: the etchant is dropped on the sample surface, eroded using wipe-mop method. Compared with the existing technologies, the advantages of the invention is to take electrolytic polishing and flannel polishing at the same time, combining chemical corrosion, optimized selecting the etchant of HF:HCl:H2O=2:3:18, to successful prepare metallographic examination samples. It is a high efficiency for sample preparation, low labor intensity, and it is the technology to obtain a very clear and integrity crystal boundary.

Application Domain

Technology Topic

Silk clothEtching +10

Image

  • Method for preparing Al-Si-Cu-based alloy metallographic sample and displaying tissue thereof
  • Method for preparing Al-Si-Cu-based alloy metallographic sample and displaying tissue thereof
  • Method for preparing Al-Si-Cu-based alloy metallographic sample and displaying tissue thereof

Examples

  • Experimental program(1)
  • Comparison scheme(2)

Example Embodiment

[0032] Example one
[0033] The sample undergoes the following preparation steps:
[0034] a. Rough grinding: take about 1.5cm 2 The sample is polished with water on 400# alumina water sandpaper, then polished with water with 1000# alumina water sandpaper, then polished with water with 1500# alumina water sandpaper, and then polished with water with 2000# silicon carbide water sandpaper Before changing the sandpaper, turn 90 degrees until the scratches in the previous process are worn away, and the new scratches are in the same direction. Before changing the sandpaper, the sample should be cleaned with water to remove the sand.
[0035] b. Electrolytic polishing: Polish the rough ground sample with an electrolytic polishing machine. The polishing parameters are voltage 25V, time 20s, and polish 3 times. After each finish, rinse with water and cool.
[0036] c. Flannel polishing: Use 1μm diamond abrasive paste to polish on silk cloth, one-way polishing, light pressure, slow speed, drop a small amount of water on it during polishing, polish for about 1 minute, rinse with water after polishing, and blow dry , At this time, the surface of the sample is as bright as a mirror.
[0037] d. Chemical corrosion: Take an appropriate amount of corrosive liquid, drop a small amount of cotton on the surface of the polished sample, and etch it for 5 minutes using the wiping method. The volume ratio of each component of the etchant formulation is as follows: HF:HCl:H 2 O=2:3:18.
[0038] This embodiment is a metallographic photo of Al-1%Si-0.5%Cu prepared by the technology of the present invention. From the figure, the grain boundaries of aluminum alloy can be clearly seen, and the grain boundaries are clear and easy to measure, as shown in Figure 3 .
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