Electronic carrier board and its packaging structure

A carrier board and electronic technology, which is applied in the direction of assembling printed circuits, circuits, and electrical components with electrical components, which can solve the problem that the encapsulation resin at the bottom of passive components cannot flow in, avoid gas explosion and electrical bridging problems, and prevent improper electrical The effect of sexual bridging

Active Publication Date: 2007-07-11
SILICONWARE PRECISION IND CO LTD
View PDF1 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] Another object of the present invention is to provide an electronic carrier board and its assembly structure, which can use the existing carrier board process technology to solve the problem that the bottom packaging resin of 0201 or smaller surface mount (SMT) passive components cannot flow into the problem

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic carrier board and its packaging structure
  • Electronic carrier board and its packaging structure
  • Electronic carrier board and its packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Please refer to FIG. 5A, FIG. 5B, and FIG. 5C, which are a schematic plan view of Embodiment 1 of the electronic carrier board of the present invention, and a schematic cross-sectional and plan view of Embodiment 1 of electronic components assembled on the electronic carrier board. Among them, it should be noted that Yes, the drawings are all simplified schematic diagrams, only illustrating the basic structure of the present invention in a schematic manner. Therefore, only elements related to the present invention are shown in the drawings, and the number, shape, and size ratio of the shown elements are not drawn in actual implementation, and the layout of the elements may be more complicated.

[0045] As shown in the figure, the electronic carrier 51 of the present invention includes: a body 511; a plurality of welding pads 52 arranged in pairs on the surface of the body 511; and a protective layer 53 for covering the surface of the body, the protective layer 53 Openin...

Embodiment 2

[0055] Please refer to FIG. 6A and FIG. 6B , which are schematic plan views of Embodiment 2 of the electronic carrier board of the present invention, and a schematic cross-sectional view of Embodiment 2 of constructing electronic components on the electronic carrier board.

[0056] The electronic carrier board and its assembly structure of Embodiment 2 of the present invention are substantially the same as those of Embodiment 1 above, the main difference is that the corresponding openings 530, 530' formed in the protective layer (solder resist layer) 53 are larger in size than the solder pads 52 is of such a size that the solder pad 52 completely exposes the protection layer 53, thereby forming a non-solder mask defined (NSMD) solder pad.

[0057] Similarly, when a passive component such as a 0201 type chip is correspondingly connected, the distance S1 between the exposed pads 52 is 250 microns, and the distance S4 between the edge of the opening 530 and the edge of the non-sol...

Embodiment 3

[0059] Please refer to FIG. 7A and FIG. 7B , which are schematic plan views of Embodiment 3 of the electronic carrier board of the present invention, and schematic cross-sectional views of Embodiment 3 of constructing electronic components on the electronic carrier board.

[0060] The electronic carrier board and its assembly structure of Embodiment 3 of the present invention are substantially the same as Embodiment 1 above, the main difference is that the groove 54 is rectangular.

[0061] It should also be noted that the solder pads 52 exposed from the protection layer 53 may be solder mask defined solder pads or non-solder mask defined solder pads, which are not limited by this drawing.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

This invention discloses one electron load board and its form structure, wherein, the electron load board comprises one body, multiple pairs of weld pads on body surface and one protection layer to cover on body surface. Comparing with current technique, this electron load board and its structure forms insulation resin channel space between weld pads to distribute insulation resin materials onto electron load board gaps.

Description

technical field [0001] The present invention relates to an electronic carrier board and a structural structure, in particular to an electronic carrier board and a structural structure applied in Surface Mounted Technology (SMT). Background technique [0002] With the advancement of integrated circuit production technology, the design and production of electronic components continue to develop towards the trend of miniaturization, and because they have larger-scale and highly integrated electronic circuits, their product functions are also more complete. [0003] In this case, the electronic components traditionally connected by Through Hole Technology (Through Hole Technology, THT) cannot be further reduced in size, thus occupying such as printed circuit board (Printed Circuit Board; PCB), circuit board (circuit board) or substrate (substrate) and other electronic carrier boards have a lot of space, plus the plug-in assembly technology needs to drill holes on the electronic ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/00H05K3/30H05K13/00H01L23/02
Inventor 蔡和易黄建屏黄致明蔡芳霖
Owner SILICONWARE PRECISION IND CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap