Backup board for machining process
a back-up board and machining technology, applied in the field of back-up boards, can solve the problems of poor workability of laminated resin plates, easy wear and tear and easy warping of paper-based resin plates with dimensional changes, so as to reduce the abrasion of the bits of machining tools, reduce material weight, and enhance workability
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[0040] Long fiber bundles (width: about 1˜2 cm, length: about 2˜4 m) obtained from the bast of the kenaf stem were mechanically fiberized until the average length and the average diameter of the kenaf fibers reached about 25 mm and about 100 μm, respectively. (The standard deviation in the fiber length was about 16 mm and that in the fiber diameter was about 41 μm.) Then, these kenaf fibers were piled up and needle-punched into a fibrous mat. After dipped in a phenolic resin adhesive, this fibrous mat was squeezed through a squeeze roller so that the content of the phenolic resin adhesive was adjusted to about 25 weight %. The phenolic resin adhesive used in the Example was a resol-type phenolic resin adhesive (resin component content: 50 weight %; pH 9.0; free-phenol content: 1.4 weight %; free-formaldehyde content: 0.06 weight %) having the average molecular weight of about 584 including the monomers of molecular weight of about 90˜200 and the polymers of molecular weight of about...
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