Composition for forming silica-based film, method of forming silica-based film, and electronic component provided with silica-based film
a technology of silica-based film and film, which is applied in the field of composition for forming a silica-based film, silica-based film, electronic components provided with the silica-based film, etc., can solve the problems of increasing the signal delay time due to the increase in the capacity between wires, the layer tends to further reduce its mechanical strength, and the film strength tends to decrease, so as to prevent interfacial peeling, reduce the adhesion and mechanical strength
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example 1
Making of Composition for Forming Silica-Based Film
[0106] Into a solution formed by dissolving 154.6 g of tetraethoxysilane and 120.6 g of methyltriethoxysilane in 543.3 g of cyclohexanone, 80.98 g of an aqueous solution containing 0.525 g of 70% nitric acid dissolved therein were fed dropwise for 30 minutes while being stirred. Their reaction was carried out for 5 hours after the completion of dropwise feeding, and then thus generated ethanol and cyclohexanone were partly evaporated under reduced pressure in a warm bath, whereby 583.7 g of a polysiloxane solution were obtained. The weight average molecular weight of polysiloxane determined by GPC was 1,350.
[0107] Subsequently, into 553.9 g of the polysiloxane solution, 24.86 g of polypropylene glycol (PPG-725 manufactured by Aldrich Co.), which was a pore forming compound, 498.7 g of cyclohexanone, 17.89 g of 2.38% tetramethylammonium nitrate aqueous solution (pH 3.6), and 5.5 g of 1% diluted maleic acid aqueous solution were add...
example 2
[0108] Into a solution formed by dissolving 154.6 g of tetraethoxysilane and 120.6 g of methyltriethoxysilane in 543.3 g of cyclohexanone, 80.98 g of an aqueous solution containing 0.525 g of 70% nitric acid dissolved therein were fed dropwise for 30 minutes while being stirred. Their reaction was carried out for 5 hours after the completion of dropwise feeding, and then thus generated ethanol and cyclohexanone were partly evaporated under reduced pressure in a warm bath, whereby 598.2 g of a polysiloxane solution were obtained. The weight average molecular weight of polysiloxane determined by GPC was 1,280.
[0109] Subsequently, into 514.5 g of the polysiloxane solution, 22.60 g of polypropylene glycol (PPG-725 manufactured by Aldrich Co.), which was a pore forming compound, 441.6 g of diethylene glycol dimethyl ether, 16.26 g of 2.38% tetramethylammonium nitrate aqueous solution (pH 3.6), and 5.0 g of 1% diluted maleic acid aqueous solution were added and dissolved while being stir...
example 3
Making of Interlayer Insulating Film
[0112] The compositions for forming a silica-based film obtained by Examples 1 and 2 and Comparative Example 1 were applied onto silicon wafers in a rotational fashion, so as to form coating films. For forming each coating film, the rotating speed was adjusted so as to form a film having a thickness of 0.50±0.05 μm after curing. Subsequently, the organic solvent in the coating films was eliminated over 3 minutes at 250° C., and then the coating films having the organic solvent removed therefrom were finally cured over 30 minutes at 400° C. by using a silica tube furnace in which O2 concentration was controlled so as to become about 100 pm, whereby silica-based films to become interlayer insulating films were made. Thus obtained silica films were irradiated with He—Ne laser light with wavelength of 633 nm. The film thickness determined by an ellipsometer (Ellipsometer L116B manufactured by Gaertner Scientific Corporation) from the phase difference...
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